CREDIT AGREEMENT Dated as of August 28, 2006 among SOLECTRON CORPORATION and CERTAIN SUBSIDIARIES as Borrowers, BANK OF AMERICA, N.A. as Administrative Agent and Collateral Agent, The L/C Issuers Party Hereto and The Other Lenders Party Hereto,...Credit Agreement • November 8th, 2006 • Solectron Corp • Printed circuit boards • New York
This CREDIT AGREEMENT (“Agreement”) is entered into as of August 28, 2006, among SOLECTRON CORPORATION, a Delaware corporation (the “Company”), certain Subsidiaries of the Company party hereto pursuant to Section 2.14 (each a “Designated Borrower” and, together with the Company, the “Borrowers” and each a “Borrower”), each issuer of letters of credit from time to time party hereto (collectively, the “L/C Issuers” and individually, an “L/C Issuer”), the lending institutions from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), and BANK OF AMERICA, N.A., as Administrative Agent and Collateral Agent.
SOLECTRON CORPORATION MARC ONETTO CONSULTING AGREEMENT AND GENERAL RELEASEConsulting Agreement • November 8th, 2006 • Solectron Corp • Printed circuit boards • California
This Consulting Agreement and General Release (this “Agreement”) is made by and between Marc Onetto (“Consultant”) and Solectron Corporation, a Delaware corporation (the “Company”). Consultant and the Company are collectively referred to herein as the “Parties.”
