AGREEMENT AND PLAN OF MERGER AND REORGANIZATION among ST ASSEMBLY TEST SERVICES LTD, CAMELOT MERGER, INC. and CHIPPAC, INC. Dated as of February 10, 2004Merger Agreement • February 23rd, 2004 • Chippac Inc • Semiconductors & related devices • Delaware
AGREEMENT AND PLAN OF MERGER AND REORGANIZATION, dated as of February 10, 2004 (this “Agreement”), among ST ASSEMBLY TEST SERVICES LTD, a Singapore public company limited by shares (“Parent”), CAMELOT MERGER, INC., a Delaware corporation and a wholly owned subsidiary of Parent (“Merger Sub”), and ChipPAC, INC., a Delaware corporation (the “Company”).
VOTING AGREEMENT among ST ASSEMBLY TEST SERVICES LTD and the STOCKHOLDERS OF CHIPPAC, INC. identified on the signature pages hereto Dated as of February 10, 2004Voting Agreement • February 23rd, 2004 • Chippac Inc • Semiconductors & related devices • Delaware
VOTING AGREEMENT, dated as of February 10, 2004 (this “Agreement”), among ST ASSEMBLY TEST SERVICES LTD, a Singapore public company limited by shares (“Parent”), and the stockholders (each a “Stockholder”) of ChipPAC, Inc., a Delaware corporation (the “Company”), identified on the signature pages hereto.
VOTING AGREEMENT among CHIPPAC, INC. and the SHAREHOLDERS OF ST ASSEMBLY TEST SERVICES LTD identified on the signature pages hereto Dated as of February 10, 2004Voting Agreement • February 23rd, 2004 • Chippac Inc • Semiconductors & related devices
VOTING AGREEMENT, dated as of February 10, 2004 (this “Agreement”), among CHIPPAC, INC., a Delaware corporation (the “Company”), and the shareholders (each a “Shareholder”) of ST Assembly Test Services Ltd, a Singapore public company limited by shares (“Parent”), identified on the signature pages hereto.
