0000950153-01-500878 Sample Contracts

1 EXHIBIT 10.6

Credit Agreement • August 13th, 2001 • On Semiconductor Corp • Semiconductors & related devices • New York

• Contract Type
  Credit Agreement
• Filed
  August 13th, 2001
• Company
  On Semiconductor Corp
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

LOAN FACILITY between

Loan Facility • August 13th, 2001 • On Semiconductor Corp • Semiconductors & related devices

• Contract Type
  Loan Facility
• Filed
  August 13th, 2001
• Company
  On Semiconductor Corp
• Industry
  Semiconductors & related devices

Loan Agreement Development Bank of Japan (hereinafter referred to as "A") has made the loan to SCG Japan Ltd. (hereinafter referred to as "B") upon the following terms and conditions (hereinafter referred to as the "Conditions") and those in the ANNEX...

Loan Agreement • August 13th, 2001 • On Semiconductor Corp • Semiconductors & related devices • Tokyo

• Contract Type
  Loan Agreement
• Filed
  August 13th, 2001
• Company
  On Semiconductor Corp
• Industry
  Semiconductors & related devices
• Jurisdiction
  Tokyo

GUARANTY AGREEMENT Date: October 27, 2000 To: Mr. Masami Kogayu, Governor Development Bank of Japan The undersigned (hereinafter referred to as the "Guarantor"), after having accepted the following terms and conditions, hereby guarantees all the...

Guaranty Agreement • August 13th, 2001 • On Semiconductor Corp • Semiconductors & related devices

• Contract Type
  Guaranty Agreement
• Filed
  August 13th, 2001
• Company
  On Semiconductor Corp
• Industry
  Semiconductors & related devices