Form of Underwriting Agreement TTM Technologies, Inc. [•]% Convertible Senior Notes due 201[•] Underwriting AgreementUnderwriting Agreement • May 8th, 2008 • TTM Technologies Inc • Printed circuit boards • New York
TTM Technologies, Inc., a Delaware corporation (the “Company”), proposes to issue and sell to the several Underwriters listed in Schedule 1 hereto (the “Underwriters”), for whom you are acting as Representatives (the “Representatives”), an aggregate of $[•] principal amount of its [•]% Convertible Senior Notes due 201[•] (the “Firm Securities”), and, at the option of the Underwriters, up to an additional aggregate of $[•] principal amount of its [•]% Convertible Senior Notes due 201[•] (the “Additional Securities”). The Firm Securities and the Additional Securities are herein referred to as the “Securities.” The Securities will be issued pursuant to a Supplemental Indenture to be dated as of May [•], 2008 (the “Indenture”) between the Company and [•] (the “Trustee”). The Securities will be convertible into shares (the “Underlying Securities”) of common stock of the Company, par value $0.001 per share (the “Common Stock”), in accordance with the terms of the Indenture. The Company hereb
