AMKOR ASSEMBLY & TEST (SHANGHAI) CO, LTD. (as Borrower) and CHINA CONSTRUCTION BANK CO., LTD SHANGHAI WAIGAOQIAO FREE TRADE ZONE SUB-BRANCH (as Lender) US$50,000,000 Working Capital Facility Agreement Dated 20th Jan, 2009Amkor Technology Inc • May 6th, 2009 • Semiconductors & related devices
REAL PROPERTY MORTGAGE AGREEMENTAgreement • May 6th, 2009 • Amkor Technology Inc • Semiconductors & related devices
The principal debt (hereinafter referred to as the “Principal Debt”) secured by this Agreement is the debt owed by the Mortgagor to the Creditor due to the advance of the Loans by the Creditor to the Mortgagor under the Facility Agreement, including all principal of such Loans and interest accrued thereon and any other amount which shall be paid by the Mortgagor to the Creditor for the advance of the Loans under the Facility Agreement.
