LOAN AND SECURITY AGREEMENTLoan and Security Agreement • February 8th, 2023 • Amtech Systems Inc • Special industry machinery, nec
Contract Type FiledFebruary 8th, 2023 Company IndustryThis LOAN AND SECURITY AGREEMENT dated as of January 17, 2023 (the “Agreement”), is executed by and among AMTECH SYSTEMS, INC., an Arizona corporation (the “Parent Borrower”), BRUCE TECHNOLOGIES, INC., a Massachusetts corporation, BTU INTERNATIONAL, INC., a Delaware corporation, INTERSURFACE DYNAMICS, INC., a Connecticut corporation, P.R. HOFFMAN MACHINE PRODUCTS, INC., an Arizona corporation, and ENTREPIX, INC., an Arizona corporation (collectively with the Parent Borrower, the “Borrower”), each of which has its chief executive office located at 131 S. Clark Drive, Tempe, Arizona 85288, and UMB BANK, N.A., national banking association (the “Lender”), whose address is 2777 East Camelback Rd., Ste. 350, Phoenix, Arizona 85016.
AGREEMENT AND PLAN OF MERGER by and among AMTECH SYSTEMS, INC., ENTREPIX, INC., EMERALD MERGER SUB, INC., TIMOTHY P. TOBIN, as the Shareholders’ Representative and TIMOTHY P. TOBIN and STEVEN N. HOROWITZ, as the Key Shareholders dated as of January...Merger Agreement • February 8th, 2023 • Amtech Systems Inc • Special industry machinery, nec • Arizona
Contract Type FiledFebruary 8th, 2023 Company Industry JurisdictionTHIS AGREEMENT AND PLAN OF MERGER (this “Agreement”), is made and entered into as of January 17, 2023, by and among (i) Entrepix, Inc., an Arizona corporation (the “Company”), (ii) Amtech Systems, Inc., an Arizona corporation (“Buyer”), (iii) Emerald Merger Sub, Inc., an Arizona corporation and wholly owned Subsidiary of Buyer (“Merger Sub” and, together with the Company, the “Constituent Corporations”), (iv) Timothy P. Tobin, solely in his capacity as the shareholders’ representative as set forth in this Agreement (the “Shareholders’ Representative”) and (v) the Key Shareholders (defined below). Capitalized terms used and not otherwise defined herein have the meanings set forth in ARTICLE XI below.