0001009448-13-000061 Sample Contracts

SUBORDINATION AND INTERCREDITOR AGREEMENT
Subordination and Intercreditor Agreement • December 17th, 2013 • Plures Technologies, Inc./De • Semiconductors & related devices • Massachusetts

This SUBORDINATION AND INTERCREDITOR AGREEMENT (this “Agreement”) is made as of December 10, 2013, by and among ADVANCED MICROSENSORS CORPORATION, a New York corporation having its principal place of business at 333 South Street, Shrewsbury, Massachusetts 01545 (“AMS”), PLURES TECHNOLOGIES, INC., a Delaware corporation having its principal place of business at 4070 West Lake Drive, Canandaigua, New York 14424 (“Plures”), MASSACHUSETTS DEVELOPMENT FINANCE AGENCY, a body corporate and politic created under and acting pursuant to authority derived from Chapter 23G of the Massachusetts General Laws, as amended, and having a principal place of business at 99 High Street, 11th Floor, Boston, MA 02110. (“MDFA”) and CEDARVIEW OPPORTUNITIES MASTER FUND, L.P., as agent for a group of lenders, One Penn Plaza, 45th Floor, New York, NY 10119 (collectively “Lender”).

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SUBORDINATION AGREEMENT
Subordination Agreement • December 17th, 2013 • Plures Technologies, Inc./De • Semiconductors & related devices • New York

This Subordination Agreement is made as of December 10, 2013 by and among each of the undersigned creditors (individually, a “Creditor” and, collectively, the “Creditors”), Plures Technologies, Inc. and Advanced Microsensors Corporation (collectively, the “Borrower”), and Cedarview Opportunities Master Fund, P.C., as agent for certain lenders (collectively, the “Lender”).

SUBORDINATION AGREEMENT
Subordination Agreement • December 17th, 2013 • Plures Technologies, Inc./De • Semiconductors & related devices • California

This Subordination Agreement is made as of December 10, 2013 by and among each of the undersigned creditors (individually, a “Creditor” and, collectively, the “Creditors”), Advanced Microsensors Corporation (“Borrower”), and Hercules Technology Growth Capital, Inc. (the “Lender”).

LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • December 17th, 2013 • Plures Technologies, Inc./De • Semiconductors & related devices • New York

Loan Agreement made as of the 10th day of December 2013 by and between the persons on Schedule A (collectively the “Lender”) and Plures Technologies, Inc., a Delaware corporation (“Plures”) and Advanced MicroSensors Corporation, a New York corporation (collectively “Borrower”).

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