CONFIDENTIAL TREATMENT REQUESTED LICENSE AGREEMENTLicense Agreement • February 25th, 2003 • California Micro Devices Corp • Electronic components & accessories
FCT has developed Confidential Information, trade secrets, patents and know-how regarding Ultra CSP™ wafer bumping in the manufacture of flip chip integrated circuits; and certain Confidential Information, trade secrets, patents and know-how regarding the technology of redistributing bond pads on integrated circuits using a Redistribution Layer (RDL) to facilitate wafer bumping in the manufacture of flip chip integrated circuits.
LOAN DEFAULT WAIVER AGREEMENTLoan Default Waiver Agreement • February 25th, 2003 • California Micro Devices Corp • Electronic components & accessories
THIS LOAN DEFAULT WAIVER AGREEMENT is entered into as of October 21, 2002, by and between CALIFORNIA MICRO DEVICES CORPORATION, a California corporation (the “Borrower”) and SILICON VALLEY BANK (“Bank”). Borrower and Bank are parties to a Loan and Security Agreement, dated June 17, 2002, as amended or modified from time to time, (the “Loan Agreement”). Defined terms used but not otherwise defined herein shall have the same meanings as set forth in the Loan Agreement.
