LOAN CONVERSION AGREEMENTLoan Conversion Agreement • August 10th, 2007 • Emagin Corp • Semiconductors & related devices • New York
Contract Type FiledAugust 10th, 2007 Company Industry JurisdictionLOAN CONVERSION AGREEMENT, dated as of August 7, 2007 (this “Agreement”), between eMagin Corporation, a Delaware corporation (the “Company”), and Moriah Capital, L.P., a Delaware limited partnership (together with its successors and any assignees, “Lender”).
INTERCREDITOR AGREEMENTIntercreditor Agreement • August 10th, 2007 • Emagin Corp • Semiconductors & related devices • New York
Contract Type FiledAugust 10th, 2007 Company Industry Jurisdiction
REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • August 10th, 2007 • Emagin Corp • Semiconductors & related devices • New York
Contract Type FiledAugust 10th, 2007 Company Industry JurisdictionThis Agreement is made pursuant to the Securities Issuance Agreement, dated as of the date hereof, by and between the Lender and the Company (as amended, modified or supplemented from time to time, the “Securities Issuance Agreement”), and pursuant to the Loan and Security Agreement (the “Loan Agreement”) referred to therein.
SECURITIES ISSUANCE AGREEMENTSecurities Issuance Agreement • August 10th, 2007 • Emagin Corp • Semiconductors & related devices • New York
Contract Type FiledAugust 10th, 2007 Company Industry JurisdictionTHIS SECURITIES ISSUANCE AGREEMENT (this “Agreement”) is made and entered into as of August 7, 2007, by and between eMagin Corporation, a Delaware corporation (the “Company”), and Moriah Capital, L.P., a Delaware limited partnership (the “Lender”).
POST-CLOSING AGREEMENTPost-Closing Agreement • August 10th, 2007 • Emagin Corp • Semiconductors & related devices
Contract Type FiledAugust 10th, 2007 Company IndustryPOST-CLOSING AGREEMENT (“Agreement”) dated this 7th day of August, 2007, with respect to the Loan and Security Agreement, dated this 7th day of August, 2007 (“Loan Agreement”) by and between EMAGIN CORPORATION, a Delaware corporation, with its principal place of business located at 10500 N.E. 8th Street, Suite 1400, Bellevue, Washington 98004 ("Borrower"), and MORIAH CAPITAL, L.P., a Delaware limited partnership with offices at 685 Fifth Avenue, New York, New York 10022 ("Lender"). Capitalized terms used but not defined herein have the meanings given to them in the Loan Agreement.
SECURED CONVERTIBLE REVOLVING LOAN NOTEConvertible Revolving Loan Note • August 10th, 2007 • Emagin Corp • Semiconductors & related devices • New York
Contract Type FiledAugust 10th, 2007 Company Industry JurisdictionFOR VALUE RECEIVED, the undersigned, EMAGIN CORPORATION, a Delaware corporation, with its principal place of business located at 10500 N.E. 8th Street, Suite 1400 Bellevue, Washington 12533 (“eMagin” and “Borrower”) promises to pay to the order of MORIAH CAPITAL, L.P., a Delaware limited partnership with offices at 685 Fifth Avenue, New York, New York 10022, and its successors and assigns (“Lender”), on or before the Maturity Date, the principal sum of up to Two Million Five Hundred Thousand Dollars ($2,500,000) in accordance with the Loan and Security Agreement, of even date herewith, entered into by and between Borrower and Lender (as amended from time to time, the “Agreement”). Capitalized terms used herein and not defined herein shall have their respective meanings as set forth in the Agreement.
LOAN AND SECURITY AGREEMENT by and between MORIAH CAPITAL, L.P., as Lender, and EMAGIN CORPORATION, as Borrower Dated: August 7, 2007Loan and Security Agreement • August 10th, 2007 • Emagin Corp • Semiconductors & related devices • New York
Contract Type FiledAugust 10th, 2007 Company Industry JurisdictionTHIS LOAN AND SECURITY AGREEMENT dated this 7th day of August 2007 by and between EMAGIN CORPORATION, a Delaware corporation, with its principal place of business located at 10500 N.E. 8th Street, Suite 1400, Bellevue, Washington 98004 (the "Borrower"), and MORIAH CAPITAL, L.P., a Delaware limited partnership with offices at 685 Fifth Avenue, New York, New York 10022 (as further defined below, the "Lender").