ContractForbearance Agreement • March 3rd, 2003 • Ddi Capital Corp/Dynamic Details Inc • Printed circuit boards • New York
FORBEARANCE AGREEMENT, dated as of February 26, 2003 (the “Forbearance Agreement”) among (i) DDi Capital Corp., formerly known as Details Capital Corp. (the “Company”); (ii) Dynamic Details, Incorporated, formerly known as Details, Inc. (“Details”); (iii) Dynamic Details Incorporated, Silicon Valley, formerly known as Dynamic Circuits, Inc. (“DCI”, and collectively with Details, the “Borrowers”); (iv) each Subsidiary Guarantor (together with the Company and the Borrowers, the “Grantors”); (v) the several banks and other financial institutions from time to time parties to the Credit Agreement referred to below (individually, a “Lender,” and collectively, the “Lenders”); (vi) Bankers Trust Company, as documentation and co-syndication agent; and (vi) JPMorgan Chase Bank, as collateral, co-syndication and administrative agent (in such capacity, the “Administrative Agent”).
