EXHIBIT 10.98 LOAN AND SECURITY AGREEMENT --------------------------- This Loan and Security Agreement (this "Agreement"), effective 13 May, 1997 (the "Effective Date"), is by and between (a) Texas Instruments Singapore (Pte) Limited, a Singapore...Loan and Security Agreement • August 14th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
AMENDMENT --------- This Amendment, dated as of July 11, 1997, is made and entered into between Microelectronic Packaging America (the "Borrower") and Citicorp USA, Inc. (the "Lender").Promissory Note Amendment • August 14th, 1997 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • New York
