CREDIT AGREEMENTCredit Agreement • May 15th, 2007 • Flextronics International Ltd. • Printed circuit boards • New York
This CREDIT AGREEMENT (“Agreement”) is entered into as of May 10, 2007, among FLEXTRONICS INTERNATIONAL LTD., a Singapore corporation (the “Company” or “FIL”) acting, subject to Section 10.19 hereof, through its Bermuda branch, certain Subsidiaries of the Company party hereto pursuant to Section 2.14 (each a “Designated Borrower” and, together with the Company, the “Borrowers” and, each a “Borrower”), each lender from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), BANK OF AMERICA, N.A., as Administrative Agent and Swing Line Lender, and BANK OF AMERICA, N.A. and THE BANK OF NOVA SCOTIA, as L/C Issuers.
