RENEWAL OF GARDEN GROVE LEASEDpac Technologies Corp • June 1st, 2004 • Semiconductors & related devices
By this Lease Landlord leases to Tenant and Tenant leases from Landlord the Premises in the Building as set forth and described on the Reference Pages. The Premises are depicted on the floor plan attached hereto as Exhibit A, and the Building is depicted on the site plan attached hereto as Exhibit A-1. The Reference Pages, including all terms defined thereon, are incorporated as part of this Lease.
Commercial Lease Termination AgreementCommercial Lease Termination Agreement • June 1st, 2004 • Dpac Technologies Corp • Semiconductors & related devices • California
This Commercial Lease Termination Agreement (this "Agreement") dated January 20, 2004 is made between Bravante-Curci Investors, L.P., a California limited partnership ("BCI"), and DPAC Technologies Corp., a California Corporation ("Lessee").
EMPLOYMENT AGREEMENT AMENDMENTEmployment Agreement • June 1st, 2004 • Dpac Technologies Corp • Semiconductors & related devices
This Employment Agreement Amendment (this "Amendment") is made as of September 27, 2002 (the "Effective Date"), by and between DPAC Technologies (formerly Dense-Pac Microsystems, Inc.), a California corporation (the "Company") and William M. Stowell (the "Executive").
ASSET PURCHASE AGREEMENTAsset Purchase Agreement • June 1st, 2004 • Dpac Technologies Corp • Semiconductors & related devices • California
This Asset Purchase Agreement (this "Agreement") is dated and effective May 6, 2004, by and between Twilight Technology, Inc., a California corporation (the "Buyer") and DPAC Technologies Corp., a California corporation ("DPAC" or the "Company"). Buyer and Company are collectively referred to herein as the "Parties" and individually as a "Party." Capitalized terms used herein shall have the meanings set forth in this Agreement.
SECURITIES PURCHASE AGREEMENTCommon Stock Purchase Warrant • June 1st, 2004 • Dpac Technologies Corp • Semiconductors & related devices • New York
This Securities Purchase Agreement (this "Agreement") is dated as of May 5, 2004, among DPAC Technologies Corp., a California corporation (the "Company"), and each purchaser identified on the signature pages hereto (each, including its successors and assigns, a "Purchaser" and collectively the "Purchasers"); and
