SEMILEDS CORPORATION (a Delaware corporation) · Shares of Common Stock UNDERWRITING AGREEMENTUnderwriting Agreement • October 6th, 2010 • SemiLEDs Corp • Semiconductors & related devices • New York
Loan Agreement (Used for Short-term, Medium-term, and Long-term Loan)Loan Agreement • October 6th, 2010 • SemiLEDs Corp • Semiconductors & related devices
This Loan Agreement (the “Agreement”) is made and entered into by SemiLEDs Optoelectronics Co. Ltd., represented by Chairman Trung Doan (hereinafter the “Borrower”) and the guarantor who shall act as a joint and several guarantor for the Borrower (hereinafter the “Guarantor”, and the Guarantor and the Borrower hereinafter collectively the “Obligors”) for application of the loan facility from E. Sun Bank (hereinafter the “Bank”). In addition to comply with the Credit Facility Agreement, the Joint Guarantee Agreement and other agreements entered into with the Bank, The Obligors agree to comply with the terms and condition as follows:
AMENDED AND RESTATED PATENT ASSIGNMENT AND LICENSE AGREEMENT BY AND BETWEEN SemiLEDs Corporation AND Xurui Guangdian Co., Ltd. ON July 19, 2010Patent Assignment and License Agreement • October 6th, 2010 • SemiLEDs Corp • Semiconductors & related devices
SemiLEDs Corporation, an American corporation incorporated and existing under the laws of USA, with registered office at 999 Main Street, Suite 1010, Boise, ID83702, USA and duly represented by Trung Tri Doan (nationality: USA) (hereinafter referred to as “Assignor”); and
SEMI-PHOTONICS CO., LTD. INTERNATIONAL DISTRIBUTION AGREEMENTInternational Distribution Agreement • October 6th, 2010 • SemiLEDs Corp • Semiconductors & related devices • California
This International Distribution Agreement (the “Agreement”) is made and entered into effective December 20, 2006 (the “Effective Date”) between SEMI-PHOTONICS CO., LTD., a company with offices at 7F, No.13 Ke Jung Rd., Chu-Nan Site, Hsinchu Science Park, Chu- Nan 350, Taiwan (“Company”), and NANOTECO CORP., a Japanese company with offices at 408 Mitaka Sangyo Plaza, 3-38-4 Shimorenjaku, Mitaka, Tokyo, 181-8525 Japan (“Distributor”).
LEASE AGREEMENTLease Agreement • October 6th, 2010 • SemiLEDs Corp • Semiconductors & related devices
THIS LEASE AGREEMENT (this “Agreement”) is entered into as of this fist day of December, 2006 (“Effective Date”), by and between SEMI-PHOTONICS CO., LTD., a Taiwan company having offices at 7F, No.13, Ke Jung Rd., Chu-Nan Site, Hsinchu Science Park, Chu-Nan 350, Miao-Li County, Taiwan, the Republic of China (“R.O.C.”) (the “Lessee”), and LUXXON TECHNOLOGY CORPORATION, a Taiwan company having offices at 12-5, Dungshr, 2 Lin, Dungming Tsuen, Shinwu Shiang, 327, Taoyuan County, Taiwan, R.O.C. (the “ Lessor”). The Lessee and the Lessor are hereinafter referred to individually as a “Party” and collectively as the “Parties.”
Agreement for Issuance of Overseas Letter of Credit(the “Agreement”)SemiLEDs Corp • October 6th, 2010 • Semiconductors & related devices
The contracting party: SemiLEDs Optoelectronics Co., Ltd., represented by the Chairman, Trung Doan (hereinafter referred to as the “Appointer”).In order to proceed settlement of exchange at E.Sun Bank (hereinafter referred to as the “Bank”) for purchasing the goods and materials from foreign countries, the Appointer invites the guarantor bearing the joint and several liabilities hereunder (hereinafter referred to as the “Guarantor”, together with the Appointer as the contracting parties) to execute the Agreement. Based on the percentage of the letter of credit (hereinafter referred to as “L/C”) approved by the Bank and in accordance with the agreed deposits, the Appointer commissions the Bank to issue overseas L/C on a oone-timeo partial xcycle basis and to advance payment in foreign currency (hereinafter referred to as “advance payment”) or accept or apply for delivery for an import collection under the guarantee delivery / bill of lading endorsed or borrowing etc., up to the amount o
Loan Agreement (Used for Short-term, Medium-term, and Long-term Loan)Loan Agreement • October 6th, 2010 • SemiLEDs Corp • Semiconductors & related devices
This Loan Agreement (the “Agreement”) is made and entered into by SemiLEDs Optoelectronics Co. Ltd., represented by Chairman Trung Doan (hereinafter the “Borrower”) and the guarantor who shall act as a joint and several guarantor for the Borrower (hereinafter the “Guarantor”, and the Guarantor and the Borrower hereinafter collectively the “Obligors”) for application of the loan facility from E. Sun Bank (hereinafter the “Bank”). In addition to comply with the Credit Facility Agreement, the Joint Guarantee Agreement and other agreements entered into with the Bank, The Obligors agree to comply with the terms and condition as follows:
