SEPARATION AGREEMENTSeparation Agreement • May 28th, 2013 • Flextronics International Ltd. • Printed circuit boards • California
This Separation Agreement is entered into between Flextronics International USA, Inc., together with its parent company, Flextronics International Ltd., and any predecessor, successor, or affiliated companies (collectively, the "Company") and Eslie C. Sykes ("Sykes"). In consideration of the mutual promises set forth below, the Company and Sykes have agreed as follows:
FIRST SUPPLEMENTAL INDENTURE dated as of March 28, 2013 among FLEXTRONICS INTERNATIONAL LTD. The Guarantor Party Hereto and U.S. Bank National Association, as TrusteeFlextronics International Ltd. • May 28th, 2013 • Printed circuit boards • New York
THIS FIRST SUPPLEMENTAL INDENTURE (this "Supplemental Indenture"), entered into as of March 28, 2013, among Flextronics International Ltd., a Singapore company (the "Company"), Flextronics Telecom Systems Ltd, a private limited company formed under the laws of the Republic of Mauritius (the "Subsidiary Guarantor"), and U.S. Bank National Association, as trustee (the "Trustee").
