VIA OPTRONICS AG AND THE BANK OF NEW YORK MELLON As Depositary AND OWNERS AND HOLDERS OF AMERICAN DEPOSITARY SHARES Deposit AgreementDeposit Agreement • September 21st, 2020 • Via Optronics AG • Semiconductors & related devices • New York
Contract Type FiledSeptember 21st, 2020 Company Industry Jurisdiction
FRAMEWORK AGREEMENT between VIA OPTRONICS GMBH and TOPPAN PRINTING CO., LTD. dated November 30, 2017Framework Agreement • September 21st, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 21st, 2020 Company IndustryThis Framework Agreement (this “Agreement”) is entered into on [November 30], 2017 between VIA optronics GmbH, a company organized under the laws of Germany (“VIA”), and Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Toppan”). Each of Toppan and VIA is referred to as a “Party”, and together, as the “Parties”.
BUSINESS ASSISTANCE AGREEMENTBusiness Assistance Agreement • September 21st, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 21st, 2020 Company IndustryThis Business Assistance Agreement (the “Agreement”) is entered into on March 29, 2018, between Toppan Printing Co., Ltd., a company organized under the laws of Japan (“Toppan”), and VTS-Touchsensor Co., Ltd. (formerly known as Toppan Touch Panel Products, Co., Ltd.), a company organized under the laws of Japan (the “Company”). This Agreement is effective from March 26, 2018 (the “Effective Date”). Each of Toppan and the Company is referred to as a “Party”, and together, as the “Parties”.
UNDERWRITING AGREEMENTUnderwriting Agreement • September 21st, 2020 • Via Optronics AG • Semiconductors & related devices • New York
Contract Type FiledSeptember 21st, 2020 Company Industry JurisdictionThis letter is being delivered to you in connection with the proposed Underwriting Agreement (the “Underwriting Agreement”), between VIA optronics AG, a German stock corporation (Aktiengesellschaft) (the “Company”), and you as representative of a group of Underwriters (the “Underwriters”) named therein, relating to an underwritten public offering of American Depositary Shares (“ADSs”) representing ordinary shares with a notional value of €1.00 each (“Shares”) of the Company (the “Offering”).
VIA OPTRONICS AGShareholders’ Agreement • September 21st, 2020 • Via Optronics AG • Semiconductors & related devices
Contract Type FiledSeptember 21st, 2020 Company Industry