0001072993-99-000135 Sample Contracts

FIRST AMENDMENT TO DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENT
Debt Conversion and Mutual Settlement and Release Agreement • August 16th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Sample 1Sample 2Sample 3See All (11)
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DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENT
Debt Conversion and Mutual Settlement and Release Agreement • August 16th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Sample 1Sample 2Sample 3See All (9)
DEBT CONVERSION AND MUTUAL SETTLEMENT AND RELEASE AGREEMENT
Debt Conversion and Mutual Settlement Agreement • August 16th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Sample 1Sample 2Sample 3
EXHIBIT 10.88 February 18, 1999 Mr. Jong-Won Chang Legal Team Samsung, Corning Co., Ltd. 472 Shin-dong Paldal-gu Suwon Si Kyunggi-do Korea RE: Conditional Agreement Reached on Conversion of Debt to Equity Dear Mr.Chang: As of today, Transpac, Texas...
Conditional Agreement • August 16th, 1999 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Sample 1
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