0001104659-05-037674 Sample Contracts

FIRST AMENDMENT TO AGREEMENT AND PLAN OF REORGANIZATION

Agreement and Plan of Reorganization • August 9th, 2005 • Dpac Technologies Corp • Semiconductors & related devices • Ohio

• Contract Type
  Agreement and Plan of Reorganization
• Filed
  August 9th, 2005
• Company
  Dpac Technologies Corp
• Industry
  Semiconductors & related devices
• Jurisdiction
  Ohio

This First Amendment to the Agreement and Plan of Reorganization, dated as of August 5, 2005 (the “Amendment”) is entered into by and among DPAC Technologies Corp., a California corporation (“DPAC”), DPAC Acquisition Sub, Inc., an Ohio corporation (“DPAC Sub”), and QuaTech, Inc., an Ohio corporation (“QuaTech”).

Security Agreement

Security Agreement • August 9th, 2005 • Dpac Technologies Corp • Semiconductors & related devices • Delaware

• Contract Type
  Security Agreement
• Filed
  August 9th, 2005
• Company
  Dpac Technologies Corp
• Industry
  Semiconductors & related devices
• Jurisdiction
  Delaware

THIS SECURITY AGREEMENT (this “Agreement”), dated as of this 5th day of August, 2005, is made by DPAC TECHNOLOGIES CORP. (the “Grantor”), with an address at 7321 Lincoln Way, Garden Grove, California 92841, in favor of DEVELOPMENT CAPITAL VENTURES, LP (the “Lender”), with an address at 4443 Brookfield Corporate Drive, Suite 110, Chantilly, Virginia 20151.

LICENSE AGREEMENT

License Agreement • August 9th, 2005 • Dpac Technologies Corp • Semiconductors & related devices • Ohio

• Contract Type
  License Agreement
• Filed
  August 9th, 2005
• Company
  Dpac Technologies Corp
• Industry
  Semiconductors & related devices
• Jurisdiction
  Ohio

THIS LICENSE AGREEMENT (the “Agreement”) is made and entered into as of August 5, 2005 (“Effective Date”) by and among DPAC Technologies Corp., a California corporation (“DPAC”), Development Capital Ventures LP, a Delaware limited partnership (“DCV”) and QuaTech, Inc., an Ohio corporation (“QuaTech”).