CREDIT AGREEMENT June 7, 2007 among NATIONAL SEMICONDUCTOR CORPORATION, VARIOUS LENDERS, and GOLDMAN SACHS CREDIT PARTNERS L.P., as Lead Arranger and the AgentCredit Agreement • June 12th, 2007 • National Semiconductor Corp • Semiconductors & related devices • New York
This CREDIT AGREEMENT, dated as of June 7, 2007, is entered into by and among NATIONAL SEMICONDUCTOR CORPORATION, a Delaware corporation (the “Borrower”), the Lenders party hereto from time to time, and GOLDMAN SACHS CREDIT PARTNERS L.P. (“GSCP”), as the Agent (together with its permitted successors in such capacity, the “Agent”).
