DEPOSIT AGREEMENT by and among RDA MICROELECTRONICS, INC. AND CITIBANK, N.A., as Depositary, AND THE HOLDERS AND BENEFICIAL OWNERS OF AMERICAN DEPOSITARY SHARES ISSUED HEREUNDER Dated as of November 9, 2010Deposit Agreement • March 15th, 2013 • RDA Microelectronics, Inc. • Semiconductors & related devices • New York
ASSET PURCHASE AGREEMENT by and among RDA Microelectronics, Inc. Coolsand Holdings Co., Ltd. Masshall Limited and Coolsand Technologies (Hong Kong) Limited Dated as of March 22, 2012Asset Purchase Agreement • March 15th, 2013 • RDA Microelectronics, Inc. • Semiconductors & related devices • New York
This Asset Purchase Agreement, dated as of March 22, 2012 (this “Agreement”), is made by and among Coolsand Holdings Co., Ltd., a Cayman Islands corporation, Masshall Limited, a British Virgin Islands corporation, and Coolsand Technologies (Hong Kong) Limited, a Hong Kong corporation, (each a “Seller,” and collectively the “Sellers”) and RDA Microelectronics, Inc., a Cayman Islands corporation (the “Purchaser”). All capitalized terms used herein shall have the meanings specified in Article I below or elsewhere in this Agreement, as applicable.
ANNEX 1 RDA TECHNOLOGIES LIMITED MALI 400MP TERMTechnology Licence Agreement • March 15th, 2013 • RDA Microelectronics, Inc. • Semiconductors & related devices
This Annex 1, when signed by both parties, shall form part of and be incorporated into the Technology Licence Agreement (“TLA”) between the parties (document reference as identified in the table above). Solely for the purposes of interpretation of the TLA with respect to this Annex 1, to the extent that the provisions contained in this Annex 1 conflict with any of the provisions of the TLA the provisions contained in this Annex 1 shall prevail over and shall supersede the conflicting provisions in the TLA.
ANNEX 1 RDA TECHNOLOGIES LIMITED CONFIGURABLE SYSTEM PRODUCTS NIC-301, QoS-301, GIC-390, SMC-353 FIXED SYSTEM PRODUCTS L2C-310, DMC-400 AMBA DESIGNERTechnology Licence Agreement • March 15th, 2013 • RDA Microelectronics, Inc. • Semiconductors & related devices
This Annex 1, when signed by both parties, shall form part of and be incorporated into the Technology Licence Agreement (“TLA”) between the parties (document reference as identified in the table above). Solely for the purposes of interpretation of the TLA with respect to this Annex 1, to the extent that the provisions contained in this Annex 1 conflict with any of the provisions of the TLA the provisions contained in this Annex 1 shall prevail over and shall supersede the conflicting provisions in the TLA.
ANNEX 1 RDA TECHNOLOGIES LIMITED CORTEX-A7 MPCORE, CORTEX-A7 FPU, CORTEX-A7 NEONTechnology Licence Agreement • March 15th, 2013 • RDA Microelectronics, Inc. • Semiconductors & related devices
This Annex, when signed by both parties, shall form part of and be incorporated into the Technology Licence Agreement (“TLA”) between the parties (document reference as identified in the table above). Solely for the purposes of interpretation of the TLA with respect to this Annex, to the extent that the provisions contained in this Annex conflict with any of the provisions of the TLA the provisions contained in this Annex shall prevail over and shall supersede the conflicting provisions in the TLA.
INTELLECTUAL PROPERTY ASSIGNMENTIntellectual Property Assignment • March 15th, 2013 • RDA Microelectronics, Inc. • Semiconductors & related devices • New York
This INTELLECTUAL PROPERTY ASSIGNMENT (the “Assignment”) is made this 22nd day of March, 2012, by and among Coolsand Holdings Co., Ltd., a Cayman Islands corporation, Masshall Limited, a British Virgin Islands corporation, and Coolsand Technologies (Hong Kong) Limited, a Hong Kong corporation, (each a “Assignor,” and collectively the “Assignors”) and RDA Microelectronics, Inc., a Cayman Islands corporation (the “Assignee”).
ANNEX 1 RDA TECHNOLOGIES LIMITED CORTEX-A5 UP / CORTEX-A5MP / CORTEX-A5 FPU / CORTEX-A5 NEONTechnology Licence Agreement • March 15th, 2013 • RDA Microelectronics, Inc. • Semiconductors & related devices
This Annex 1, when signed by both parties, shall form part of and be incorporated into the Technology Licence Agreement (“TLA”) between the parties (document reference as identified in the table above). Solely for the purposes of interpretation of the TLA with respect to this Annex 1, to the extent that the provisions contained in this Annex 1 conflict with any of the provisions of the TLA the provisions contained in this Annex 1 shall prevail over and shall supersede the conflicting provisions in the TLA.
ANNEX 1 RDA TECHNOLOGIES LIMITED PIPD TECHNOLOGY — CELL LIBRARIES AND PERFORMANCE OPTIMISATION PACKAGE — FOR TSCM 40NM PROCESSTechnology License Agreement • March 15th, 2013 • RDA Microelectronics, Inc. • Semiconductors & related devices
This Annex 1, when signed by both parties, shall form part of and be incorporated into the Technology Licence Agreement (“TLA”) between the parties (document reference as identified in the table above). Solely for the purposes of interpretation of the TLA with respect to this Annex 1, to the extent that the provisions contained in this Annex 1 conflict with any of the provisions of the TLA the provisions contained in this Annex 1 shall prevail over and shall supersede the conflicting provisions in the TLA.
ANNEX 1 RDA TECHNOLOGIES LIMITED MALI-300 — IP ACCESSTechnology Licence Agreement • March 15th, 2013 • RDA Microelectronics, Inc. • Semiconductors & related devices
This Annex 1, when signed by both parties, shall form part of and be incorporated into the Technology Licence Agreement (“TLA”) between the parties (document reference as identified in the table above). Solely for the purposes of interpretation of the TLA with respect to this Annex 1, to the extent that the provisions contained in this Annex 1 conflict with any of the provisions of the TLA the provisions contained in this Annex 1 shall prevail over and shall supersede the conflicting provisions in the TLA.
ANNEX 1 RDA TECHNOLOGIES LIMITED PIPD TECHNOLOGY — COMPILERS — FOR TSCM 40NM PROCESSTechnology Licence Agreement • March 15th, 2013 • RDA Microelectronics, Inc. • Semiconductors & related devices
This Annex 1, when signed by both parties, shall form part of and be incorporated into the Technology Licence Agreement (“TLA”) between the parties (document reference as identified in the table above). Solely for the purposes of interpretation of the TLA with respect to this Annex 1, to the extent that the provisions contained in this Annex 1 conflict with any of the provisions of the TLA the provisions contained in this Annex 1 shall prevail over and shall supersede the conflicting provisions in the TLA.
ANNEX 1 RDA TECHNOLOGIES LIMITED CORESIGHT DK-A5Technology Licence Agreement • March 15th, 2013 • RDA Microelectronics, Inc. • Semiconductors & related devices
This Annex, when signed by both parties, shall form part of and be incorporated into the Technology Licence Agreement (“TLA”) between the parties (document reference as identified in the table above). Solely for the purposes of interpretation of the TLA with respect to this Annex, to the extent that the provisions contained in this Annex conflict with any of the provisions of the TLA the provisions contained in this Annex shall prevail over and shall supersede the conflicting provisions in the TLA.
