SECURITY AGREEMENTSecurity Agreement • May 3rd, 2013 • Semtech Corp • Semiconductors & related devices • New York
This SECURITY AGREEMENT dated as of May 2, 2013 is entered among SEMTECH CORPORATION, a Delaware corporation, as borrower (“Borrower”), and each direct or indirect Domestic Subsidiary of Borrower, in each case as a Guarantor pursuant to the Credit Agreement (as defined below), and that is a party hereto as of the date set forth above or as is from time to time made a party hereto pursuant to Section 6.11 of the Credit Agreement by executing and delivering to Administrative Agent a Security Agreement Supplement in the form attached hereto as Annex A (each Borrower and each Guarantor being individually referred to herein as a “Grantor” and, collectively, as the “Grantors”) in favor of HSBC BANK USA, NATIONAL ASSOCIATION, a national banking association, not in its individual capacity, but solely in its capacity as Administrative Agent as the representative and for the benefit of the Secured Parties (“Administrative Agent”).
