CREDIT AGREEMENT dated as of March 1, 2016 among AMPHENOL CORPORATION, as Parent Borrower and a Guarantor AMPHENOL EAST ASIA LIMITED, as Hong Kong Borrower andCredit Agreement • March 2nd, 2016 • Amphenol Corp /De/ • Electronic connectors • New York
Contract Type FiledMarch 2nd, 2016 Company Industry JurisdictionCREDIT AGREEMENT, dated as of March 1, 2016 (as may be amended, restated, supplemented or otherwise modified from time to time, this “Agreement”) among AMPHENOL CORPORATION, a Delaware corporation (the “Company”), AMPHENOL EAST ASIA LIMITED, a private limited company incorporated in Hong Kong (the “Hong Kong Borrower”), certain additional Subsidiaries of the Company party hereto pursuant to Section 2.14 (together with the Hong Kong Borrower, the “Designated Borrowers”, and each a “Designated Borrower”, and together with the Company, the “Borrowers”, and each a “Borrower”), certain Subsidiaries of the Company from time to time party hereto (each a “Subsidiary Guarantor” and together with the Company, the “Guarantors”), each lender from time to time party hereto (collectively, the “Lenders” and each individually, a “Lender”) and JPMORGAN CHASE BANK, N.A., as Administrative Agent, Swingline Lender and an L/C Issuer.