CREDIT AGREEMENT by and among SUPERCOM INC., as Borrower, SUPERCOM LTD., as Parent, SUPERCOM IP LLC, as SPE Guarantor, and DBFIP SCL LLC, as Lender September 6, 2018Credit Agreement • December 4th, 2019 • SuperCom LTD • Semiconductors & related devices • New York
THIS CREDIT AGREEMENT (as amended, restated, amended and restated, supplemented or otherwise modified from time to time, this “Agreement”) entered into as of September 6, 2018, among DBFIP SCL LLC, a Delaware limited liability company (“Lender”), SUPERCOM INC., a Delaware corporation (“Borrower”), SuperCom Ltd., an Israeli company (“Parent”) and SUPERCOM IP LLC, a Nevada limited liability company (“SPE Guarantor”).
