Fixed Asset Loan ContractPhotronics Inc • January 15th, 2021 • Semiconductors & related devices
Whereas, Party A applies for a loan to Party B for the construction of “Hefei Photronics Co., Ltd., 10.5 generation plant new project,” Party B agrees to issue the loan to Party A. In accordance with the relevant regulations and rules, Party A and Party B consent to execute and abide by the following contract through negotiation and consultation.
Maximum Mortgage ContractMortgage Contract • January 15th, 2021 • Photronics Inc • Semiconductors & related devices
In view of the fact that Party B is going to conduct (and/or have already conducted) the following credit business for Hefei Fengchuang Photomask Co., Ltd. (hereinafter referred to as the “debtor”) on consecutive basis for the following (1),(2),(3) and (4) items from mm__dd 2020 to mm dd 2021 (hereinafter referred to as “Determination Period of Claims” ) by concluding loan contract of RMB funds, loan contracts of foreign exchange funds, bank acceptance agreement, letter of credit issuance contract, letter of guarantee issuance agreements and/or other legal Documents ( the aforementioned contracts, agreements and/or other legal documents concluded during the determination period of the claims are hereinafter referred to as the “Master Contract” ).
MASTER LEASE AGREEMENTMaster Lease Agreement • January 15th, 2021 • Photronics Inc • Semiconductors & related devices • New Jersey
This Master Lease Agreement (“Agreement”) is dated as of October 12, 2020 by and between TD EQUIPMENT FINANCE, INC. (“Lessor”), having an office at 2059 Springdale Road, Cherry Hill, New Jersey 08003, and PHOTRONICS, INC. (“Lessee”). If more than one person or entity executes the Agreement as “Lessee,” then the term “Lessee” shall mean each person or entity executing the Agreement both individually and Jointly, and each such person or entity shall have joint and several liability under the Agreement.
