LOAN AGREEMENTLoan Agreement • March 31st, 2010 • Master Silicon Carbide Industries, Inc. • Semiconductors & related devices • New York
AGREEMENT made on this 10th day of February, 2010, by and between China Silicon Corporation, a Delaware corporation (“Debtor”) and Master Silicon Carbide Industries, Inc., a Nevada corporation (“Creditor”). All references to Creditor herein shall also refer to Creditor’s permitted assignees under this Agreement.
CONSENT AND WAIVER AGREEMENTConsent and Waiver Agreement • March 31st, 2010 • Master Silicon Carbide Industries, Inc. • Semiconductors & related devices • New York
THIS CONSENT AND WAIVER AGREEMENT (the "Agreement") is made and entered into on November 2, 2009, by and between Master Silicon Carbide Industries, Inc. (formerly known as Paragon Semitech USA, Inc.), a Nevada corporation (the “Company”), and the holders of the Company’s Series A Preferred Stock, as defined below, listed on the signature pages below (collectively, the “Holders”).
