LOAN AGREEMENTLoan Agreement • March 31st, 2011 • Master Silicon Carbide Industries, Inc. • Semiconductors & related devices • New York
Contract Type FiledMarch 31st, 2011 Company Industry JurisdictionAGREEMENT made on this 14th day of April, 2010, by and between China Silicon Corporation, a Delaware corporation (“Debtor”) and Master Silicon Carbide Industries, Inc., a Nevada corporation (“Creditor”). All references to Creditor herein shall also refer to Creditor’s permitted assignees under this Agreement.