AMENDED AND RESTATED REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • June 30th, 2009 • Tower Semiconductor LTD • Semiconductors & related devices
This Registration Rights Agreement (this “Agreement”) originally made on September 28, 2006 by and between TOWER SEMICONDUCTOR LTD. (the “Company” or “Tower”), a company organized under the laws of the State of Israel, and BANK HAPOALIM B.M., a banking corporation organized under the laws of the State of Israel (the “Bank”), is hereby amended and restated by the parties on September 25, 2008.
SECURITIES PURCHASE AGREEMENTSecurities Purchase Agreement • June 30th, 2009 • Tower Semiconductor LTD • Semiconductors & related devices
This Securities Purchase Agreement (the “Agreement”) is made and entered into effective as of September 25, 2008 by and between TOWER SEMICONDUCTOR LTD. (the “Company” or “Tower”), a company organized under the laws of the State of Israel and ISRAEL CORPORATION LTD., a company organized under the laws of the State of Israel (the “Purchaser”).
CONVERSION AGREEMENTConversion Agreement • June 30th, 2009 • Tower Semiconductor LTD • Semiconductors & related devices • Tel-Aviv
This Conversion Agreement (this “Agreement”) is made and entered into effective as of September 25, 2008 by and between TOWER SEMICONDUCTOR LTD. (the “Company” or “Tower”), a company organized under the laws of the State of Israel and BANK LEUMI LE-ISRAEL B.M., a banking corporation organized under the laws of the State of Israel (the “Bank”).
CONVERSION AGREEMENTConversion Agreement • June 30th, 2009 • Tower Semiconductor LTD • Semiconductors & related devices • Tel-Aviv
This Conversion Agreement (this “Agreement”) is made and entered into effective as of September 25 2008 by and between TOWER SEMICONDUCTOR LTD. (the “Company” or “Tower”), a company organized under the laws of the State of Israel and ISRAEL CORPORATION LTD., a corporation organized under the laws of the State of Israel ( “TIC”).
RESTATED FACILITY AGREEMENT Originally made on 18 January 2001 Between TOWER SEMICONDUCTOR LTD. as the Borrower and BANK HAPOALIM B.M. BANK LEUMI LE–ISRAEL B.M. as the Banks (as amended and restated by the parties through September 29, 2008)Facility Agreement • June 30th, 2009 • Tower Semiconductor LTD • Semiconductors & related devices • Tel-Aviv
A M E N D I N G A G R E E M E N T TO THE FACILITY AGREEMENTFacility Agreement • June 30th, 2009 • Tower Semiconductor LTD • Semiconductors & related devices • Tel-Aviv
WHEREAS: THE BORROWER, ON THE ONE HAND, AND THE BANKS, ON THE OTHER HAND, ARE PARTIES TO A FACILITY AGREEMENT DATED JANUARY 18, 2001, AS AMENDED AND RESTATED ON AUGUST 24, 2006 AND AS FURTHER AMENDED BY AMENDMENT NO.1 THERETO DATED SEPtember 10, 2007 ("the Facility Agreement"); and
PLEDGE AGREEMENTPledge Agreement • June 30th, 2009 • Tower Semiconductor LTD • Semiconductors & related devices
THIS PLEDGE AGREEMENT (as amended, restated, supplemented or otherwise modified from time to time, this “Agreement”) dated as of September 25, 2008, is by and among TOWER SEMICONDUCTOR LTD., a company incorporated under the laws of Israel (company no. 52-004199-7) (the “Borrower”), BANK HAPOALIM B.M. and BANK LEUMI LE-ISRAEL B.M., as the Security Banks (as defined below), and BANK HAPOALIM, NEW YORK BRANCH, on behalf of the Security Banks (as defined below), as Collateral Trustee (in such capacity, the “Collateral Trustee”).
