Re: Modification and Waiver AgreementLetter Agreement • August 2nd, 2006 • Oasys Mobile, Inc. • Services-business services, nec
Contract Type FiledAugust 2nd, 2006 Company IndustryThis letter agreement (the “Agreement”) sets forth the terms and conditions pursuant to which RHP Master Fund, Ltd. (“RHP”) and LAP Summus Holdings, LLC (“LAP” and, together with RHP, the “Buyers”) will waive certain of its rights under that certain Securities Purchase Agreement dated as of November 18, 2005 (the “Purchase Agreement”) by and among RHP, LAP and Oasys Mobile, Inc. (f/k/a Summus, Inc.), a Delaware corporation (the “Company”), and all of the other documents and instruments entered into in connection therewith, including without limitation, the Debentures, the Warrants, the Security Agreement and the Registration Rights Agreement (collectively, the “Transaction Documents”).