0001193125-03-078656 Sample Contracts

SETTLEMENT AGREEMENT AND GENERAL RELEASE

Settlement Agreement and General Release • November 12th, 2003 • Chippac Inc • Semiconductors & related devices

• Contract Type
  Settlement Agreement and General Release
• Filed
  November 12th, 2003
• Company
  Chippac Inc
• Industry
  Semiconductors & related devices

This Settlement Agreement and General Release (hereinafter “Agreement”) is entered into as of this 26th day of September, 2003 (“Effective Date”), by and between Richard Freeman (hereinafter “Employee”) and ChipPAC, Inc. (hereinafter the “Company”).