AMENDED AND RESTATED CREDIT AGREEMENT dated as of August 4, 1999, as Amended and Restated as of November 25, 2003, among ON SEMICONDUCTOR CORPORATION, SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, The Lenders Party Hereto and JPMORGAN CHASE BANK, as...Credit Agreement • March 10th, 2004 • On Semiconductor Corp • Semiconductors & related devices • New York
AMENDED AND RESTATED CREDIT AGREEMENT dated as of August 4, 1999, as amended and restated as of November 25, 2003, among ON SEMICONDUCTOR CORPORATION (formerly known as SCG Holding Corporation), SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, the LENDERS party hereto and JPMORGAN CHASE BANK (formerly known as The Chase Manhattan Bank), as Administrative Agent.
THIS LOANS RENEWAL AGREEMENT (hereinafter referred as this ‘Agreement’) is entered into on March 5, 2004 by Party A: Leshan Phoenix Semiconductor Co. Ltd. Party B: Industrial and Commercial Bank of China, Leshan City BranchLoan Renewal Agreement • March 10th, 2004 • On Semiconductor Corp • Semiconductors & related devices
In accordance with the friendly mutual consultation by Party A and Party B, NOW it is therefore agreed to make the following supplements to the ‘LOAN FACILITY’ which was signed by the parties on November 17, 2000, in an amount equal to Twenty Million US Dollars (US$20,000,000) which was divided into two separate loan facilities; one of RMB33,200,000 (the ‘RMB Portion’) and one of US$16,000,000 (the ‘US$ Portion’):
ContractCredit Agreement • March 10th, 2004 • On Semiconductor Corp • Semiconductors & related devices • New York
WAIVER AND AMENDMENT (this “Amendment”) dated as of January 16, 2004 to the Credit Agreement dated as of August 4, 1999, as amended and restated as of November 25, 2003 (as amended, supplemented or otherwise modified from time to time prior to the date hereof, the “Credit Agreement”), among ON SEMICONDUCTOR CORPORATION (formerly known as SCG HOLDING CORPORATION, “Holdings”), SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (the “Borrower”), the LENDERS party thereto, and JPMORGAN CHASE BANK (formerly known as The Chase Manhattan Bank), as administrative agent.
Letter for Loan Extension ApplicationLoan Extension Agreement • March 10th, 2004 • On Semiconductor Corp • Semiconductors & related devices
In accordance with Section 3.2 of the loan facility (“Loan Agreement”) entered into on November 17, 2000 between Leshan-Phoenix Semiconductor Company Limited (“Leshan”) and the Industrial and Commercial Bank of China, Leshan hereby requests extensions for the draw-downs under the Loan Agreement, as set forth below. Pursuant to Section 3.2, Leshan requests that the original due date of each draw down be extended by three years. Kindly review and confirm in writing by November 14, 2003 the below loan extensions. All such extensions of maturity shall be on the same terms applied at the time of the original draw-down.
ContractReaffirmation Agreement • March 10th, 2004 • On Semiconductor Corp • Semiconductors & related devices • New York
REAFFIRMATION AGREEMENT, dated as of November 25, 2003, among ON SEMICONDUCTOR CORPORATION (formerly known as SCG HOLDING CORPORATION) (“Holdings”), SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (the “Borrower”), each subsidiary of Holdings listed on the signature pages hereof (collectively, the “Subsidiary Loan Parties” and, together with Holdings and the Borrower, the “Reaffirming Parties”) and JPMORGAN CHASE BANK, as Administrative Agent, Issuing Bank and Collateral Agent (in such capacities, “JPMCB”) for the benefit of the Lenders (such term and each other capitalized term used but not defined herein having the meaning assigned to such term in the Amended and Restated Credit Agreement referred to below).
LOAN AGREEMENTLoan Agreement • March 10th, 2004 • On Semiconductor Corp • Semiconductors & related devices
ContractAmendment and Restatement Agreement • March 10th, 2004 • On Semiconductor Corp • Semiconductors & related devices • New York
AMENDMENT AND RESTATEMENT AGREEMENT dated as of November 25, 2003 (this “Agreement”), among ON SEMICONDUCTOR CORPORATION (formerly known as SCG HOLDING CORPORATION) (“Holdings”), SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (the “Borrower”), the LENDERS party hereto and JPMORGAN CHASE BANK (formerly known as THE CHASE MANHATTAN BANK), as administrative agent (the “Administrative Agent”), under the Credit Agreement dated as of August 4, 1999, as amended and restated as of September 17, 2003 (as amended, supplemented and modified and in effect on the date hereof, the “Existing Credit Agreement”), among Holdings, the Borrower, the lenders party thereto and the Administrative Agent.
Mortgage Agreement Between China Construction Bank, Sichuan Branch and Leshan- Phoenix Semiconductor Company Ltd.Mortgage Agreement • March 10th, 2004 • On Semiconductor Corp • Semiconductors & related devices
