SEPARATION AGREEMENTSeparation Agreement • March 12th, 2004 • Chippac Inc • Semiconductors & related devices • California
THIS SEPARATION AGREEMENT (the “Agreement”) is made and entered into and is effective as of this 10th day of February 2004, by and among ST Assembly Test Services Ltd, a Singapore public company limited by shares (the “Company”), CHIPPAC, Inc., a Delaware company (“CHIPPAC”) and Dennis McKenna (the “Executive”).
