MASTER LEASE AGREEMENT Semiconductor Manufacturing Equipment January 5, 2005 SumiCrest Leasing Ltd. Spansion Japan LimitedMaster Lease Agreement • March 1st, 2005 • Advanced Micro Devices Inc • Semiconductors & related devices
This Master Lease Agreement is made and entered into by and between SumiCrest Leasing Ltd. (“Lessor”) and Spansion Japan Limited (“Lessee”) on January 5, 2005.
AMENDED AND RESTATED LIMITED LIABILITY COMPANY OPERATING AGREEMENT OF FASL LLC a Delaware Limited Liability CompanyLimited Liability Company Operating Agreement • March 1st, 2005 • Advanced Micro Devices Inc • Semiconductors & related devices • Delaware
THIS AMENDED AND RESTATED LIMITED LIABILITY COMPANY OPERATING AGREEMENT (this “Agreement”) is made and entered into as of the 30th day of June, 2003 (the “Launch Date”), by and between AMD Investments, Inc., a Delaware corporation (“AMD Member”), and Fujitsu Microelectronics Holding, Inc., a Delaware corporation (“Fujitsu Member”), for the purpose of amending and restating the terms of the Limited Liability Company Operating Agreement dated May 15, 2003 (the “Original Agreement”) of FASL LLC (the “Company”), a limited liability company organized under the Delaware Limited Liability Company Act, as amended from time to time (the “Act”). In addition, Advanced Micro Devices, Inc., a Delaware corporation (“AMD”), and Fujitsu Limited, a corporation organized under the laws of Japan (“Fujitsu”), are entering into this Agreement as of the date first set forth above and are parties hereto not in the capacity of Members of the Company but in order to receive the benefit of and be bound by the a
MASTER PURCHASE AGREEMENT Semiconductor Manufacturing Equipment January 5, 2005 Spansion Japan Limited SumiCrest Leasing Ltd.Master Purchase Agreement • March 1st, 2005 • Advanced Micro Devices Inc • Semiconductors & related devices
This Master Purchase Agreement is made and entered into by and between Spansion Japan Limited (“Lessee”) and SumiCrest Leasing Ltd. (“Lessor”) on January 5, 2005.
Cooperation Agreement (hereinafter referred to as the “Agreement”)Cooperation Agreement • March 1st, 2005 • Advanced Micro Devices Inc • Semiconductors & related devices
The maintenance and development of Saxony as a center for microelectronics, in particular, of Dresden as a high-technology location, is a top priority political and structural goal of Saxony, in order to maintain existing and secure new qualified jobs. AMD intends to build a new facility in Dresden for the production of 300mm silicon wafers on which integrated circuits, particularly for microprocessors, will be manufactured (the “Wafers”). In addition to production, own research and development on a considerable scale to develop up to suitability for industrial production semiconductor manufacturing technology will be carried out at the new facility.
AMD-FASL PATENT CROSS-LICENSE AGREEMENTPatent Cross-License Agreement • March 1st, 2005 • Advanced Micro Devices Inc • Semiconductors & related devices • California
THIS AMD-FASL PATENT CROSS-LICENSE AGREEMENT (this “Agreement”) is made and entered into as of June 30, 2003 (the “Effective Date”), by and between Advanced Micro Devices, Inc., a Delaware corporation (“Parent”) and FASL LLC, a Delaware limited liability company (“FASL”). Parent and FASL are hereinafter also referred to, collectively, as the “Parties” and individually as a “Party.”
AMD DISTRIBUTION AGREEMENT JUNE 30, 2003Distribution Agreement • March 1st, 2005 • Advanced Micro Devices Inc • Semiconductors & related devices • California
THIS DISTRIBUTION AGREEMENT (this “Agreement”) is made and entered into as of June 30, 2003 (the “Effective Date”), by and between FASL LLC, a Delaware limited liability company (“FASL”), and Advanced Micro Devices, Inc., a Delaware corporation (“AMD”). FASL and AMD are hereinafter also referred to as the “Parties” and individually as a “Party.”
NON-COMPETITION AGREEMENTNon-Competition Agreement • March 1st, 2005 • Advanced Micro Devices Inc • Semiconductors & related devices • California
THIS NON-COMPETITION AGREEMENT (this “Agreement”) is made and entered into as of June 30, 2003, by and among Advanced Micro Devices, Inc., a Delaware corporation (“AMD”), AMD Investments, Inc., a Delaware corporation (“AMD Investments,” and together with AMD, the “AMD Entities”), Fujitsu Limited, a corporation organized under the laws of Japan (“Fujitsu”), Fujitsu Microelectronics Holding, Inc., a Delaware corporation (“Fujitsu Sub,” and together with Fujitsu, the “Fujitsu Entities,” and collectively with the AMD Entities, the “Entities”), and FASL LLC, a Delaware limited liability company (the “Joint Venture” and collectively with the Entities, the “Parties”).
AGREEMENT between SI INVESTMENT LIMITED LIABILITY COMPANY & CO KG and Pertaining to the Design and Construction of Fab X, Dresden, GermanyDesign and Construction Agreement • March 1st, 2005 • Advanced Micro Devices Inc • Semiconductors & related devices
This Design/Build Agreement (hereinafter referred to as “Agreement”) is made and entered into this 20th of November, 2003 by and between SI Investment Limited Liability Company & Co KG, Louis-Braille-Straße 5, 01099 Dresden, Germany (hereinafter referred to as “Company”) and M+W Zander Facility Engineering GmbH, Lotterbergstraße 30, 70499 Stuttgart, Germany (hereinafter referred to as “Contractor”). Company and Contractor, are collectively referred to as “Parties” or each separately as “Party”.
