THIS FIRST AMENDING AGREEMENT is made as of the 31st day of March, 2005Loan Agreement • April 6th, 2005 • SMTC Corp • Printed circuit boards • Ontario
Contract Type FiledApril 6th, 2005 Company Industry JurisdictionWHEREAS Canadian Borrower and Lender entered into a loan agreement dated June 1, 2004 (the “Loan Agreement”) pursuant to which certain credit facilities were established in favour of Canadian Borrower;
THIS FIRST AMENDING AGREEMENT is made as of the 31st day of March, 2005Loan Agreement • April 6th, 2005 • SMTC Corp • Printed circuit boards • Illinois
Contract Type FiledApril 6th, 2005 Company Industry JurisdictionWHEREAS US Borrowers, Lender and US Collateral Agent entered into a loan agreement dated June 1, 2004 (the “Loan Agreement”) pursuant to which certain credit facilities were established in favour of US Borrowers;