SECURITY AGREEMENTSecurity Agreement • July 6th, 2005 • Hoku Scientific Inc • Miscellaneous electrical machinery, equipment & supplies • Hawaii
THIS SECURITY AGREEMENT (Security Agreement) made this 9th day of June, 2005, by and between HOKU SCIENTIFIC, INC., a Delaware corporation (hereafter called the Debtor), and CENTRAL PACIFIC BANK, a Hawaii corporation (hereafter called the Secured Party),
LOAN AGREEMENTLoan Agreement • July 6th, 2005 • Hoku Scientific Inc • Miscellaneous electrical machinery, equipment & supplies • Hawaii
THIS AGREEMENT, is made on June 9, 2005, by and between CENTRAL PACIFIC BANK, a Hawaii corporation, whose mailing address is P. O. Box 3590, Honolulu, Hawaii 96811-3590 (the Lender), and HOKU SCIENTIFIC, INC., a Delaware corporation, whose principal place of business and post office address is 2153 North King Street, Suite 300, Honolulu, Hawaii 96819 (the Borrower);
