0001193125-05-187045 Sample Contracts

FORM OF AMENDED AND RESTATED NON-COMPETITION AGREEMENT
Non-Competition Agreement • September 19th, 2005 • Spansion Inc. • Semiconductors & related devices • California

THIS AMENDED AND RESTATED NON-COMPETITION AGREEMENT (this “Agreement”) is made and entered into as of , 2005, by and among Advanced Micro Devices, Inc., a Delaware corporation (“AMD”), AMD Investments, Inc., a Delaware corporation (“AMD Investments,” and together with AMD, the “AMD Entities”), Fujitsu Limited, a corporation organized under the laws of Japan (“Fujitsu,” and collectively with the AMD Entities, the “Entities”), and Spansion Inc., a Delaware corporation (“Spansion” and collectively with the Entities, the “Parties”).

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FORM OF AMENDED AND RESTATED FUJITSU-SPANSION PATENT CROSS-LICENSE AGREEMENT
Fujitsu-Spansion Patent Cross-License Agreement • September 19th, 2005 • Spansion Inc. • Semiconductors & related devices • California

THIS AMENDED AND RESTATED FUJITSU-SPANSION PATENT CROSS-LICENSE AGREEMENT (this “Agreement”) is made and entered into as of , 2005 (the “Amendment Date”), by and between Fujitsu Limited, a Japanese corporation (“Parent” or “Fujitsu”) and Spansion Inc., a Delaware corporation (“Spansion”). Parent and Spansion are hereinafter also referred to, collectively, as the “Parties” and individually as a “Party.”

FORM OF AMENDED AND RESTATED INTELLECTUAL PROPERTY CONTRIBUTION AND ANCILLARY MATTERS AGREEMENT
Intellectual Property Contribution Agreement • September 19th, 2005 • Spansion Inc. • Semiconductors & related devices • California

THIS AMENDED AND RESTATED INTELLECTUAL PROPERTY CONTRIBUTION AND ANCILLARY MATTERS AGREEMENT (“Agreement”) is made and entered into as of , 2005 (“Amendment Date”) by and among Fujitsu Limited, a Japanese corporation (“Fujitsu”), Advanced Micro Devices, Inc., a Delaware corporation (“AMD”), AMD Investments, Inc. (“AMD Investments”), Spansion Inc., a Delaware corporation (“Spansion”) and Spansion Technology Inc., a Delaware corporation, a wholly owned subsidiary of Spansion and the successor-in-interest to Spansion LLC (“STI”). Fujitsu, AMD, AMD Investments, Spansion and STI are herein referred to as the “Parties” and individually as a “Party.” Fujitsu and AMD Investments are herein referred to as the “Contributing Parties” and individually as a “Contributing Party.” Fujitsu and AMD are herein referred to as the “Parents” and individually as a “Parent.”

FORM OF AMENDED AND RESTATED AMD-SPANSION PATENT CROSS-LICENSE AGREEMENT
Amd-Spansion Patent Cross-License Agreement • September 19th, 2005 • Spansion Inc. • Semiconductors & related devices • California

THIS AMENDED AND RESTATED AMD-SPANSION PATENT CROSS-LICENSE AGREEMENT (this “Agreement”) is made and entered into as of , 2005 (the “Amendment Date”), by and between Advanced Micro Devices, Inc., a Delaware corporation (“Parent” or “AMD”) and Spansion Inc., a Delaware corporation (“Spansion”). Parent and Spansion are hereinafter also referred to, collectively, as the “Parties” and individually as a “Party.”

SUPPLEMENTAL SECONDMENT AND TRANSFER AGREEMENT
Supplemental Secondment and Transfer Agreement • September 19th, 2005 • Spansion Inc. • Semiconductors & related devices

THIS SUPPLEMENTAL SECONDMENT AND TRANSFER AGREEMENT (this “Agreement”) is made and entered into as of July 1, 2005 (the “Effective Date”), by and between Spansion Japan Limited, a Japanese corporation (the “Company”), and Fujitsu Limited, a Japanese corporation (“Fujitsu”). The Company and Fujitsu are hereinafter also referred to as the “Parties” and individually as a “Party”.

FORM OF FIRST AMENDMENT TO MANUFACTURING SERVICES AGREEMENT
Manufacturing Services Agreement • September 19th, 2005 • Spansion Inc. • Semiconductors & related devices • California

THIS FIRST AMENDMENT TO MANUFACTURING SERVICES AGREEMENT (this “Amendment”) is made and entered into as of August , 2005 (the “Effective Date”), by and between Spansion LLC, a Delaware limited liability company formerly known as FASL LLC (“Spansion”), and Fujitsu Limited, a corporation organized under the laws of Japan (“Fujitsu”). Spansion and Fujitsu are hereinafter also referred to as the “Parties” and individually as a “Party.”

FOUNDRY AGREEMENT
Foundry Agreement • September 19th, 2005 • Spansion Inc. • Semiconductors & related devices

**** Confidential treatment has been requested as to certain portions of this agreement. Such omitted confidential information has been designated by asterisks and has been filed separately with the Securities and Exchange Commission pursuant to Rule 406 under the Securities Act of 1933, as amended, and the Commission’s rules and regulations promulgated under the Freedom of Information Act, pursuant to a request for confidential treatment.****

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