0001193125-06-036587 Sample Contracts

AMENDED AND RESTATED CREDIT AGREEMENT dated as of August 4, 1999, as Amended and Restated as of February 6, 2006 among ON SEMICONDUCTOR CORPORATION, SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, The Lenders Party Hereto and JPMORGAN CHASE BANK, N.A. as...
Credit Agreement • February 22nd, 2006 • On Semiconductor Corp • Semiconductors & related devices • New York

AMENDED AND RESTATED CREDIT AGREEMENT dated as of August 4, 1999, as amended and restated as of February 6, 2006, among ON SEMICONDUCTOR CORPORATION, SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, the LENDERS party hereto and JPMORGAN CHASE BANK, N.A., as Administrative Agent.

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AMENDMENT NO. 1 TO REGISTRATION RIGHTS AGREEMENT
Registration Rights Agreement • February 22nd, 2006 • On Semiconductor Corp • Semiconductors & related devices

This is Amendment No. 1, dated as of December 27, 2005 (this “Amendment No. 1”) to the Registration Rights Agreement, dated as of September 7, 2001 (the “Registration Rights Agreement”), by and between ON Semiconductor Corporation, a Delaware corporation (the “Company”), and TPG ON Holdings LLC, a Delaware limited liability company (“TPG” or the “Investor”).

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Guarantee Agreement • February 22nd, 2006 • On Semiconductor Corp • Semiconductors & related devices

SUPPLEMENT NO. 1 dated as of April 3, 2000, to the Guarantee Agreement dated as of August 4, 1999, among SCG HOLDING CORPORATION, a Delaware corporation (“Holdings”), each of the subsidiaries listed on Schedule I thereto (each such subsidiary individually, a “Subsidiary” and, collectively, the “Subsidiaries”; and each such Subsidiary and Holdings, individually, a “Guarantor” and, collectively, the “Guarantors”), and THE CHASE MANHATTAN BANK, a New York banking corporation, as collateral agent (the “Collateral Agent”) for the Secured Parties (as defined in the Security Agreement).

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Amendment and Restatement Agreement • February 22nd, 2006 • On Semiconductor Corp • Semiconductors & related devices • New York

AMENDMENT AND RESTATEMENT AGREEMENT dated as of February 6, 2006 (this “Agreement”), among ON SEMICONDUCTOR CORPORATION (“Holdings”), SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (the “Borrower”), the LENDERS party hereto and JPMORGAN CHASE BANK, N.A., as administrative agent (the “Administrative Agent”), under the Amended and Restated Credit Agreement dated as of August 4, 1999, as amended and restated as of December 23, 2004 and as amended as of November 4, 2005 (as in effect on the date hereof, the “Existing Credit Agreement”), among Holdings, the Borrower, the lenders party thereto and the Administrative Agent.

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Reaffirmation Agreement • February 22nd, 2006 • On Semiconductor Corp • Semiconductors & related devices • New York

REAFFIRMATION AGREEMENT, dated as of February 6, 2006, among ON SEMICONDUCTOR CORPORATION (“Holdings”), SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (the “Borrower”), each subsidiary of Holdings listed on the signature pages hereof (collectively, the “Subsidiary Loan Parties” and, together with Holdings and the Borrower, the “Reaffirming Parties”) and JPMORGAN CHASE BANK, N.A., as Administrative Agent, an Issuing Bank and Collateral Agent (in such capacities, “JPMCB”) for the benefit of the Lenders (such term and each other capitalized term used but not defined herein having the meaning assigned to such term in the Amended and Restated Credit Agreement referred to below).

AMENDMENT NO. 2 TO EMPLOYMENT AGREEMENT FOR KEITH JACKSON
Employment Agreement • February 22nd, 2006 • On Semiconductor Corp • Semiconductors & related devices

WHEREAS, ON Semiconductor Corporation (“Company”) and Keith Jackson (“Executive”) entered into an Employment Agreement dated as of November 10, 2002 (“Agreement”);

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