FIRST AMENDMENT TO BUILDING LEASE AGREEMENTBuilding Lease Agreement • March 31st, 2006 • Magnachip Semiconductor LLC • Semiconductors & related devices
This First Amendment to Building Lease Agreement (this “Amendment”) is entered into as of December 30, 2005 by and between Hynix Semiconductor, Inc. (“Lessee”) and MagnaChip Semiconductor Ltd. (“Lessor”) (each a “Party”, and collectively the “Parties”).
FIRST AMENDMENT TO R & D EQUIPMENT UTILIZATION AGREEMENTEquipment Utilization Agreement • March 31st, 2006 • Magnachip Semiconductor LLC • Semiconductors & related devices
This First Amendment to R & D Equipment Utilization Agreement (this “Amendment”) is entered into as of December 30, 2005 by and between Hynix Semiconductor, Inc. (“Hynix”) and MagnaChip Semiconductor Ltd. (“NewCo”) (each a “Party”, and collectively the “Parties”).
THIRD AMENDMENT TO CREDIT AGREEMENTCredit Agreement • March 31st, 2006 • Magnachip Semiconductor LLC • Semiconductors & related devices • New York
THIS THIRD AMENDMENT TO CREDIT AGREEMENT (as the same may be amended, restated, supplemented, extended or otherwise modified from time to time, this “Amendment”) is entered into as of March 27, 2006, by and among MAGNACHIP SEMICONDUCTOR S.A., a société anonyme, organized and existing under the laws of the Grand Duchy of Luxembourg, having its registered office at 74, rue de Merl, B.P. 709, L-2017 Luxembourg, Grand Duchy of Luxembourg, registered with the Luxembourg Register of commerce and companies under the number B 97,483, MAGNACHIP SEMICONDUCTOR FINANCE COMPANY, a Delaware corporation (collectively, “Borrowers”), MAGNACHIP SEMICONDUCTOR LLC, a Delaware limited liability company (“Holdings”), the Subsidiary Guarantors listed on the signature pages hereto (each of Borrowers, Holdings and Subsidiary Guarantors are sometimes referred to herein as a “Loan Party” and, collectively, as the “Loan Parties”), the Lenders and UBS AG, STAMFORD BRANCH, as administrative agent (in such capacity,
Merger AgreementMerger Agreement • March 31st, 2006 • Magnachip Semiconductor LLC • Semiconductors & related devices
ISRON CORPORATION (“ISRON”) located in Shin-Osaka MT Building Number 2, 3-5-36, Miyahara, Yodogawa-ku, Osaka-shi and MagnaChip Semiconductor Inc (“MagnaChip”) located Teikoku Hotel Tower 15F, 1-1-1, Uchisaiwai-cho, Chiyoda-ku Tokyo hereby enter into this Merger Agreement (the “Merger Agreement”) as follows:
FIRST AMENDMENT TO IT & FA SERVICE AGREEMENTFa Service Agreement • March 31st, 2006 • Magnachip Semiconductor LLC • Semiconductors & related devices
This First Amendment to IT & FA Service Agreement (this “Amendment”) is entered into as of December 30, 2005 by and between Hynix Semiconductor, Inc. (“Hynix”) and MagnaChip Semiconductor Ltd. (“NewCo”) (each a “Party”, and collectively the “Parties”).
FIRST AMENDMENT TO GENERAL SERVICE SUPPLY AGREEMENTGeneral Service Supply Agreement • March 31st, 2006 • Magnachip Semiconductor LLC • Semiconductors & related devices
This First Amendment to General Service Supply Agreement (this “Amendment”) is entered into as of December 30, 2005 by and between Hynix Semiconductor, Inc. (“Hynix”) and MagnaChip Semiconductor Ltd. (“NewCo”) (each a “Party”, and collectively the “Parties”).
FIRST AMENDMENT TO LAND LEASE AND EASEMENT AGREEMENTLand Lease and Easement Agreement • March 31st, 2006 • Magnachip Semiconductor LLC • Semiconductors & related devices
This First Amendment to Land Lease and Easement Agreement (this “Amendment”) is entered into as of December 30, 2005 by and between Hynix Semiconductor, Inc. (“Lessor”) and MagnaChip Semiconductor Ltd. (“Lessee”) (each a “Party”, and collectively the “Parties”).
AGREEMENT AND PLAN OF MERGER by and between a California corporation, and MAGNACHIP SEMICONDUCTOR, INC., a Delaware corporationAgreement and Plan of Merger • March 31st, 2006 • Magnachip Semiconductor LLC • Semiconductors & related devices
This Agreement and Plan of Merger (this “Agreement”) dated as of November 17, 2005 is by and between IC Media Corporation, a California corporation (hereinafter sometimes called “IC Media”), and MagnaChip Semiconductor, Inc., a Delaware corporation (hereinafter sometimes called “MagnaChip”). IC Media and MagnaChip are sometimes hereinafter referred to as the “Constituent Corporations.”
FIRST AMENDMENT TO MASK PRODUCTION AND SUPPLY AGREEMENTMask Production and Supply Agreement • March 31st, 2006 • Magnachip Semiconductor LLC • Semiconductors & related devices
This First Amendment to Mask Production and Supply Agreement (this “Amendment”) is entered into as of December 30, 2005 by and between Hynix Semiconductor, Inc. (the “Supplier”) and MagnaChip Semiconductor Ltd. (the “Purchaser”) (each a “Party”, and collectively the “Parties”).
