SIRENZA MICRODEVICES, INC. EXECUTIVE EMPLOYMENT AGREEMENTExecutive Employment Agreement • April 6th, 2006 • Sirenza Microdevices Inc • Semiconductors & related devices • California
THIS AGREEMENT (the “Agreement”), is made and entered into by and between SIRENZA MICRODEVICES, INC. (the “Company”) and Phillip Chuanze Liao (“Executive”), and will become effective only upon and as of the Effective Date. As used herein, the “Effective Date” means the Effective Date (as defined therein) of the merger of Premier Devices, Inc., a California corporation (“Penguin”) with and into Penguin Acquisition Corporation, a California corporation and a wholly-owned subsidiary of the Company (“Merger Sub”), pursuant to the Agreement and Plan of Merger dated February 4, 2006 by and among the Company, Merger Sub, Executive, Yeechin Liao and Penguin (the “Merger Agreement”) has occurred.
ESCROW AGREEMENTEscrow Agreement • April 6th, 2006 • Sirenza Microdevices Inc • Semiconductors & related devices • Delaware
THIS ESCROW AGREEMENT (this “Agreement”) is made and entered into as of February 4, 2006 by and among Sirenza Microdevices, Inc., a Delaware corporation (“Parent”), Phillip Chuanze Liao (“Seller”), individually and as Company Shareholders Agent, and Yeechin Shiong Liao (“Spouse” and, together with Seller, the “Company Shareholders”) and U.S. Bank National Association, as escrow agent hereunder (the “Escrow Agent”).
REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • April 6th, 2006 • Sirenza Microdevices Inc • Semiconductors & related devices • Delaware
THIS REGISTRATION RIGHTS AGREEMENT (this “Agreement”) is made and entered into as of February 4, 2006, by and among Sirenza Microdevices, Inc., a Delaware corporation (the “Company”), Phillip Chuanze Liao (“Seller”) and Yeechin Shiong Liao (“Spouse” and, collectively with Seller, the “Security Holders”).
NON-COMPETITION AGREEMENTNon-Competition Agreement • April 6th, 2006 • Sirenza Microdevices Inc • Semiconductors & related devices • Colorado
THIS NON-COMPETITION AGREEMENT (this “Agreement”) is made and entered into as of February 4, 2006 by and among Sirenza Microdevices, Inc., a Delaware corporation (the “Buyer”), and the undersigned individual (the “Employee”).
