70,000,000 POST-PETITION LOAN AND SECURITY AGREEMENT by and among SILICON GRAPHICS, INC. and EACH OF ITS SUBSIDIARIES THAT ARE SIGNATORIES HERETO as Borrowers and THE LENDERS THAT ARE SIGNATORIES HERETO as the DIP Lenders Dated as of May 8, 2006Loan and Security Agreement • May 11th, 2006 • Silicon Graphics Inc • Electronic computers • New York
THIS POST-PETITION LOAN AND SECURITY AGREEMENT (this “DIP Loan Agreement”), is entered into as of May 8, 2006, by and among the lenders identified on the signature pages hereof (such lenders, together with their respective successors and permitted assigns, are referred to hereinafter each individually as a “DIP Lender” and collectively as the “DIP Lenders”), SILICON GRAPHICS, INC., a Delaware corporation (“Parent”), and each of Parent’s Subsidiaries identified on the signature pages hereof (such Subsidiaries, together with Parent, are referred to hereinafter each individually as a “Borrower,” and collectively, jointly and severally, as the “Borrowers”).
