LOAN AGREEMENT by and among DAYSTAR TECHNOLOGIES, INC., as the Company, andLoan Agreement • June 21st, 2007 • Daystar Technologies Inc • Semiconductors & related devices • New York
This LOAN AGREEMENT (this “Agreement”) is dated as of June 15, 2007 and is by and among DayStar Technologies, Inc., a Delaware corporation (the “Company”), LC Capital Master Fund, Ltd. (the “Purchaser”) and Lampe, Conway & Co., LLC, a Delaware limited liability company, as the agent and collateral agent for the Holders (“Lampe”, and in such capacities, together with its successors and assigns in such capacities, “Agent”).
SECURITY AGREEMENTSecurity Agreement • June 21st, 2007 • Daystar Technologies Inc • Semiconductors & related devices • New York
This SECURITY AGREEMENT (this “Agreement”) is dated as of June 15, 2007 and is entered into by and among DAYSTAR TECHNOLOGIES, INC., a Delaware corporation (the “Company), each of the Subsidiaries of the Company identified under the caption “Subsidiary Guarantors” on the signature pages hereto or which from time to time may become party hereto as contemplated herein (individually, a “Subsidiary Guarantor” and, collectively, the “Subsidiary Guarantors”); and LAMPE, CONWAY & CO., LLC, as the agent and collateral agent (in such capacity, together with its successors in such capacity, the “Collateral Agent”) for the Secured Parties (as defined herein).
INTELLECTUAL PROPERTY SECURITY AGREEMENTIntellectual Property Security Agreement • June 21st, 2007 • Daystar Technologies Inc • Semiconductors & related devices • New York
This INTELLECTUAL PROPERTY SECURITY AGREEMENT (this “Agreement”) is dated as of June 15, 2007 and entered into by and among DAYSTAR TECHNOLOGIES, INC., a Delaware corporation (the “Company”), each of the Subsidiaries of the Company identified under the caption “Subsidiary Guarantors” on the signature pages hereto or which from time to time may become party hereto as contemplated by the Security Agreement (as defined below) (individually a “Subsidiary Guarantor” and, collectively the “Subsidiary Guarantors” and, together with the Company, the “Obligors”), and LAMPE, CONWAY & CO., LLC, a Delaware limited liability company, as the agent and as collateral agent (in such capacity, together with its successors in such capacity, the “Collateral Agent”) for the Secured Parties (as defined herein).
SUBSIDIARY GUARANTYSubsidiary Guaranty • June 21st, 2007 • Daystar Technologies Inc • Semiconductors & related devices • New York
This SUBSIDIARY GUARANTY (this “Agreement”) is dated as of June 15, 2007 and is entered into by and among each of the Subsidiaries of DayStar Technologies, Inc., a Delaware corporation (the “Company”), identified under the caption “Subsidiary Guarantors” on the signature pages hereto or which from time to time may become party hereto as contemplated herein (individually, a “Subsidiary Guarantor” and, collectively, the “Subsidiary Guarantors”), and Lampe, Conway & Co., LLC, as the agent and collateral agent for the Holders (as defined in the Loan Agreement defined below) (in such capacities, together with its successors and assigns in such capacities, the “Agent”).
