MEMORANDUM OF UNDERSTANDINGMemorandum Of • February 28th, 2008 • Spansion Inc. • Semiconductors & related devices
THIS MEMORANDUM OF UNDERSTANDING (“MOU”) is entered into this 31st day of March, 2007 (the “Effective Date”) by and between Spansion Inc. (“Spansion”) and Fujitsu Limited (“Fujitsu”).
SPANSION INC. CHANGE OF CONTROL SEVERANCE AGREEMENTChange of Control Severance Agreement • February 28th, 2008 • Spansion Inc. • Semiconductors & related devices • California
This Change of Control Severance Agreement (the “Agreement”) is made and entered into by and between (the “Executive”) and Spansion Inc. (the “Company”), effective as of the latest date set forth by the signatures of the parties hereto below (the “Effective Date”). For purposes of the employment relationship only, the “Company” includes Spansion LLC.
AMENDMENT NO. 1 TO THE AMENDED AND RESTATED FUJITSU DISTRIBUTION AGREEMENT DATED DECEMBER 21, 2005Fujitsu Distribution Agreement • February 28th, 2008 • Spansion Inc. • Semiconductors & related devices
THIS AMENDMENT NO. 1 (this “Amendment”) to the Amended and Restated Fujitsu Distribution Agreement dated December 21, 2005 (the “Agreement”), by and between Spansion Inc., a Delaware corporation (“Spansion”) and Fujitsu Limited, a Japanese corporation (“Fujitsu”), is entered into as of December, 2007 and effective as of October 1, 2007 (the “Amendment Date”).
14,000,000,000 Yen Revolving Credit Facility AgreementRevolving Facility Agreement • February 28th, 2008 • Spansion Inc. • Semiconductors & related devices • Tokyo
THIS AGREEMENT (“this Agreement”), dated as of December 28, 2007, is entered into by and among Spansion Japan Limited, as the borrower (hereinafter referred to as the “Borrower”), the several financial institutions named in the Schedule I hereto, as lenders (hereinafter collectively referred to as the “Lenders” and individually as a “Lender”), and The Bank of Tokyo-Mitsubishi UFJ, Ltd., as the agent (hereinafter referred to as the “Agent”).
