CREDIT AGREEMENT dated as of May 23, 2008 among VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. The Lenders Party Hereto BANK OF AMERICA, N.A. as Syndication Agent and JPMORGAN CHASE BANK, N.A. as Administrative Agent J.P. MORGAN SECURITIES INC. as...Credit Agreement • May 23rd, 2008 • Varian Semiconductor Equipment Associates Inc • Special industry machinery, nec • New York
CREDIT AGREEMENT (this “Agreement”) dated as of May 23, 2008 among VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC., the LENDERS from time to time party hereto, BANK OF AMERICA, N.A., as Syndication Agent and JPMORGAN CHASE BANK, N.A., as Administrative Agent.
FORM OF NOTENote • May 23rd, 2008 • Varian Semiconductor Equipment Associates Inc • Special industry machinery, nec
FOR VALUE RECEIVED, the undersigned, Varian Semiconductor Equipment Associates, Inc., a Delaware corporation (the “Borrower”), HEREBY UNCONDITIONALLY PROMISES TO PAY to the order of [LENDER] (the “Lender”) the aggregate unpaid Dollar Amount of all Loans made by the Lender to the Borrower pursuant to the “Credit Agreement” (as defined below) on the Maturity Date or on such earlier date as may be required by the terms of the Credit Agreement. Capitalized terms used herein and not otherwise defined herein are as defined in the Credit Agreement.
