MULTI-FINELINE ELECTRONIX, INC. AND MULTI-FINELINE ELECTRONIX SINGAPORE PTE. LTD., as Borrowers LOAN AND SECURITY AGREEMENT Dated as of February 12, 2009 CERTAIN FINANCIAL INSTITUTIONS, as Lenders and BANK OF AMERICA, N.A., as AgentLoan and Security Agreement • May 7th, 2009 • Multi Fineline Electronix Inc • Printed circuit boards • California
THIS LOAN AND SECURITY AGREEMENT is dated as of February 12, 2009, among MULTI-FINELINE ELECTRONIX, INC., a Delaware corporation (“U.S. Borrower”), MULTI-FINELINE ELECTRONIX SINGAPORE PTE. LTD., a Singapore company (“Singapore Borrower, and together with U.S. Borrower, collectively, “Borrowers”), the financial institutions party to this Agreement from time to time as lenders (collectively, “Lenders”), and BANK OF AMERICA, N.A., a national banking association, as agent for the Lenders (“Agent”).
