SUPPLY AGREEMENTSupply Agreement • August 25th, 2009 • Spansion Inc. • Semiconductors & related devices • Hong Kong
Contract Type FiledAugust 25th, 2009 Company Industry JurisdictionThis SUPPLY AGREEMENT (the “Agreement”) is dated as of the Closing Date, by and between Spansion LLC, a Delaware limited liability company (“Purchaser”), and Powertech Technology Inc., a company organized under the laws of the Republic of China (Taiwan) (“Supplier”).
TRANSITION SERVICES AGREEMENTTransition Services Agreement • August 25th, 2009 • Spansion Inc. • Semiconductors & related devices • Hong Kong
Contract Type FiledAugust 25th, 2009 Company Industry JurisdictionThis TRANSITION SERVICES AGREEMENT (this “Agreement”) is made and entered into as of the Closing Date between Powertech Technology Inc., a company organized under the laws of the Republic of China (Taiwan) (“Buyer”), and Spansion LLC, a Delaware limited liability company (“Seller”).
ASSET AND SHARE PURCHASE AGREEMENT dated as of August 21, 2009 between SPANSION LLC and POWERTECH TECHNOLOGY INC.Asset and Share Purchase Agreement • August 25th, 2009 • Spansion Inc. • Semiconductors & related devices • Hong Kong
Contract Type FiledAugust 25th, 2009 Company Industry JurisdictionThis ASSET AND SHARE PURCHASE AGREEMENT (this “Agreement”) is dated as of August 21, 2009 and is entered into between Powertech Technology Inc., a company organized under the laws of the Republic of China (Taiwan) (“Buyer”), and Spansion LLC, a Delaware limited liability company (“Seller”). Each of Buyer and Seller are referred to herein as “Party” and together as the “Parties.”