SHARE PURCHASE AGREEMENT between CHIPMOS TECHNOLOGIES (BERMUDA) LTD. and SILICONWARE PRECISION INDUSTRIES CO., LTD. February 26, 2010Share Purchase Agreement • June 4th, 2010 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
Contract Type FiledJune 4th, 2010 Company IndustryThis SHARE PURCHASE AGREEMENT (this “Agreement”) is made and entered into as of February 26, 2010, by and between ChipMOS TECHNOLOGIES (Bermuda) LTD., an exempted company under the laws of Bermuda (“ChipMOS Bermuda”), and Siliconware Precision Industries Co., Ltd., a company incorporated under the laws of the Republic of China (the “SPIL”). Capitalized terms used herein shall have the meaning ascribed to them in Article IX hereto.
EQUIPMENT PURCHASE AGREEMENT between CHIPMOS TECHNOLOGIES INC. and SILICONWARE PRECISION INDUSTRIES CO., LTD. February 26, 2010Equipment Purchase Agreement • June 4th, 2010 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
Contract Type FiledJune 4th, 2010 Company IndustryThis EQUIPMENT PURCHASE AGREEMENT (this “Agreement”) is made and entered into as of February 26, 2010, by and between ChipMOS TECHNOLOGIES INC., a company incorporated under the laws of the Republic of China (“ChipMOS Taiwan” or the “Purchaser”), and Siliconware Precision Industries Co., Ltd., a company incorporated under the laws of the Republic of China (“SPIL” or the “Seller”). Capitalized terms used herein shall have the meaning ascribed to them in Article I hereto.
MASTER LEASE AGREEMENTMaster Lease Agreement • June 4th, 2010 • Chipmos Technologies Bermuda LTD • Semiconductors & related devices
Contract Type FiledJune 4th, 2010 Company IndustryMASTER LEASE AGREEMENT dated December 22, 2006 by and between GE Money Taiwan Limited (“Lessor”) and ChipMOS Technologies Inc. (“Lessee”).