AMENDMENT NO. 4 AND WAIVER TO LOAN AGREEMENTLoan Agreement • November 15th, 2010 • Multi Fineline Electronix Inc • Printed circuit boards • New York
AMENDMENT NO. 4 AND WAIVER TO LOAN AGREEMENT, dated as of August 18, 2010 (this “Agreement”), among MULTI-FINELINE ELECTRONIX, INC., a Delaware corporation (“U.S. Borrower”), MULTI-FINELINE ELECTRONIX SINGAPORE PTE. LTD., a Singapore corporation (“Singapore Borrower”, and together with U.S. Borrower, collectively, “Borrowers”), the various Subsidiaries (such capitalized term and all other capitalized terms not defined herein shall have the meanings provided for in Article I) of the Borrowers that are parties hereto, the various financial institutions that are parties hereto (collectively, “Lenders”), and BANK OF AMERICA, N.A., a national banking association, as agent for the Lenders (“Agent”).
