SEPARATION AGREEMENT AND RELEASESeparation Agreement • August 5th, 2011 • Spansion Inc. • Semiconductors & related devices • California
This Separation Agreement and Release (“Agreement”) is made by and between James P. Reid (“Executive”) and Spansion Inc. (the “Company”) (collectively referred to as the “Parties” or individually referred to as a “Party”).
AMENDMENT NUMBER THREE TO LOAN AND SECURITY AGREEMENT AND AMENDMENT NUMBER ONE TO GUARANTOR SECURITY AGREEMENTLoan and Security Agreement • August 5th, 2011 • Spansion Inc. • Semiconductors & related devices • California
This Amendment Number Three to Loan and Security Agreement and Amendment Number One to Guarantor Security Agreement (this “Amendment”), dated as of May 12, 2011, is entered into among SPANSION INC., a Delaware corporation (“Parent”), SPANSION LLC, a Delaware limited liability company (“Spansion”) and certain of Spansion’s subsidiaries party hereto (such subsidiaries together with Spansion, individually, a “Borrower” and, collectively, “Borrowers”), SPANSION TECHNOLOGY LLC, a Delaware limited liability company (“Spansion Technology”), SPANSION INTERNATIONAL, INC., a Delaware corporation (“Spansion International”), CERIUM LABORATORIES LLC, a Delaware limited liability company (together with Parent, Spansion Technology and Spansion International, individually, a “Guarantor” and collectively, “Guarantors”) each of the lenders set forth on the signature pages hereof (collectively, the “Lenders”), and BANK OF AMERICA, N.A., a national banking association, as Administrative Agent, as Sole Lea
PURCHASE AGREEMENTPurchase Agreement • August 5th, 2011 • Spansion Inc. • Semiconductors & related devices • Delaware
This Purchase Agreement (the “Agreement”) is entered into as of April 30, 2011, by and among SL Capital Appreciation Fund, L.L.C., Silver Lake Sumeru Fund, L.P. and Silver Lake Credit Fund, L.P. (each a “Seller” and collectively, “Sellers”) and Spansion LLC (“Buyer”).
AMENDMENT NO. 5 AND CONSENTCredit Agreement • August 5th, 2011 • Spansion Inc. • Semiconductors & related devices
AMENDMENT NO. 5 AND CONSENT dated as of May 11, 2011 (“Amendment No. 5”) to the Credit Agreement dated as of February 9, 2010 (as amended, supplemented or otherwise modified from time to time, the “Credit Agreement”) among Spansion LLC, a Delaware limited liability company (the “Borrower”), Spansion Inc., a Delaware corporation (“Holdings”), Spansion Technology LLC, a Delaware limited liability company (“Spansion Technology” and together with Holdings, the “Guarantors”), each lender from time to time party thereto (collectively, the “Lenders” and individually, a “Lender”), Barclays Bank PLC, as Administrative Agent (“Administrative Agent”), Collateral Agent (“Collateral Agent”) and Documentation Agent, Barclays Capital, as Joint Lead Arranger and Joint Book Runner, and Morgan Stanley Senior Funding, Inc., as Joint Lead Arranger, Joint Book Runner and Syndication Agent and Amendment No. 2 to the Pledge and Security Agreement dated as of May 10, 2010 (as amended, supplemented or otherwis
