0001193125-11-297202 Sample Contracts

PATENT LICENSE AND SETTLEMENT AGREEMENT
Patent License and Settlement Agreement • November 4th, 2011 • Spansion Inc. • Semiconductors & related devices • California

This PATENT LICENSE AND SETTLEMENT AGREEMENT (“Agreement”) is made as of July 18, 2011 (the “Effective Date”) between SAMSUNG ELECTRONICS CO. LTD. (“Samsung”) and SPANSION INC. (“Spansion”) and their respective Subsidiaries (as defined below).

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