PATENT LICENSE AND SETTLEMENT AGREEMENTPatent License and Settlement Agreement • November 4th, 2011 • Spansion Inc. • Semiconductors & related devices • California
Contract Type FiledNovember 4th, 2011 Company Industry JurisdictionThis PATENT LICENSE AND SETTLEMENT AGREEMENT (“Agreement”) is made as of July 18, 2011 (the “Effective Date”) between SAMSUNG ELECTRONICS CO. LTD. (“Samsung”) and SPANSION INC. (“Spansion”) and their respective Subsidiaries (as defined below).