Building Lease Agreement (Hachioji Azumacho Center Building) September 8, 2011Building Lease Agreement • November 10th, 2011 • Neophotonics Corp • Semiconductors & related devices
The lessor Jones Lang LaSalle K.K. (hereinafter referred to as the “Lessor”) and the lessee NeoPhotonics Japan Godo Kaisha (hereinafter referred to as the “Lessee”) hereby enter into this building lease agreement (hereinafter referred to as the “Agreement”) as follows in connection with the Lessor’s leasing the leased room specified in Item (4) of the above terms of lease (hereinafter referred to as the “Terms of Lease”) to the Lessee. The Lessor and the Lessee acknowledge that this Agreement is entered into as a sublease agreement under the building lease agreement (Master Lease Agreement) between AIG Edison Life Insurance Company as the owner of the building (hereinafter referred to as the “Owner”) and the Lessor.
THIRD AMENDMENT TO LOAN AND SECURITY AGREEMENT AND WAIVER AND CONSENTLoan and Security Agreement • November 10th, 2011 • Neophotonics Corp • Semiconductors & related devices
This Third Amendment to Loan and Security Agreement and Waiver and Consent (this “Amendment”) is entered into as of September 29, 2011, by and between COMERICA BANK (“Bank”) and NEOPHOTONICS CORPORATION (“Borrower”).
PROPERTY LEASE CONTRACT BETWEEN DONGGUAN CONRAD HI-TECH PARK LTD. AND NEOPHOTONICS (CHINA) CO., LTD.Property Lease Contract • November 10th, 2011 • Neophotonics Corp • Semiconductors & related devices
THIS PROPERTY LEASE CONTRACT (this “Contract”) is made on13thday of May, 2011, in Shenzhen, the People’s Republic of China (“China”) by and between:
LIBOR/Prime Referenced Rate Addendum To Loan and Security AgreementLoan and Security Agreement • November 10th, 2011 • Neophotonics Corp • Semiconductors & related devices
This LIBOR/Prime Referenced Rate Addendum to Loan and Security Agreement (this “Addendum”) is entered into as of September 29, 2011 by and between Comerica Bank (“Bank”) and NeoPhotonics Corporation (“Borrower”). This Addendum supplements the terms of the Loan and Security Agreement dated December 20, 2007 (as the same may be amended, modified, supplemented, extended or restated from time to time, the “Agreement”).
