0001193125-12-072371 Sample Contracts

CREDIT AGREEMENT dated as of December 23, 2011 among SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, as the Borrower ON SEMICONDUCTOR CORPORATION, as Holdings The Lenders Party Hereto JPMORGAN CHASE BANK, N.A. as Administrative Agent, and BANK OF AMERICA,...

Credit Agreement • February 22nd, 2012 • On Semiconductor Corp • Semiconductors & related devices • New York

• Contract Type
  Credit Agreement
• Filed
  February 22nd, 2012
• Company
  On Semiconductor Corp
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

CREDIT AGREEMENT (this “Agreement”) dated as of December 23, 2011 among SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, ON SEMICONDUCTOR CORPORATION, the LENDERS from time to time party hereto, JPMORGAN CHASE BANK, N.A., as Administrative Agent, and BANK OF AMERICA, N.A. and THE ROYAL BANK OF SCOTLAND plc, as Co-Syndication Agents.

EMPLOYMENT AGREEMENT

Employment Agreement • February 22nd, 2012 • On Semiconductor Corp • Semiconductors & related devices • Arizona

• Contract Type
  Employment Agreement
• Filed
  February 22nd, 2012
• Company
  On Semiconductor Corp
• Industry
  Semiconductors & related devices
• Jurisdiction
  Arizona

AGREEMENT, dated as of October 20, 2006 (the “Agreement”), between Semiconductor Components Industries, LLC (the “Company”), with offices at 5005 East McDowell Road, Phoenix, Arizona 85008, and William Schromm (the “Executive”).

AMENDMENT NO. 1 TO EMPLOYMENT AGREEMENT

Employment Agreement • February 22nd, 2012 • On Semiconductor Corp • Semiconductors & related devices

• Contract Type
  Employment Agreement
• Filed
  February 22nd, 2012
• Company
  On Semiconductor Corp
• Industry
  Semiconductors & related devices

WHEREAS, Semiconductor Components Industries, LLC (“Company”) and William Schromm (“Executive”) entered into an Employment Agreement dates as of October 20, 2006 (“Agreement”);